Sony SI-F209 SMT Pick and Place Machine for 50x50mm to 460x360mm Substrates
| Attribute | Value |
|---|---|
| Model | Sony SI-F209 |
| Substrate size | 50mm*50mm-460mm*360mm |
| Substrate thickness | 0.5mm to 2.6mm |
| Number of mounting heads | 1 head 6 nozzles |
| Mounting range | 2012(0804)-32mmIC |
| Component Height | max 7mm Mobile Camera Fixed Camera 25mm |
| Mounting speed | 0.49sec(7350CPH) |
| Mounting accuracy | 60um (CPK1.0 or above) chip |
| Power supply | AC3-phase 200V±10% 50/60HZ |
| Power consumption | 2.3kw |
| Gas consumption | 0.49MPA 100L/min |
| Appearance size | 1220mm*1700mm*1573mm |
| Weight | 1800KG |
| Machine Size | 1220*1700*1588mm |
The unit is equipped with a multifunction head that is capable of mounting parts ranging from size 2012 to φ150mm. The unit also automatically corrects the pick up position on the parts to improve the pick up rate.
To increase productivity, the unit features flying vision and flying nozzle change functions, which respectively perform parts recognition and nozzle changes, while the head is in motion after picking up or placing parts.
This system inspects leads and solder balls of the large parts such as QFP and BGA.
This is a flux and solder paste coating unit for POP mounting. Coating material is supplied automatically.
Receives and distributes production data and performs device management at will. Improves your productivity, traceability and quality levels through remote machine control.
This software optimizes the layout of nozzles and parts supply on all the SI series. Equipped with the same GUI as the unit's display, it is even easier to use.
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