4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 97*70*83CM Specification for Automatic BGA Repair

Our BGA Rework Station is designed for professional chip replacement and repair in laptops, mobile phones, gaming consoles (Xbox 360, PS3/PS4), and other electronic devices. Ideal for repair shops and factories providing after-sales service and component rework.

• Desoldering: Separate BGA chip from motherboard
• Pad cleaning
• Reballing or direct BGA chip replacement
• Precision alignment (using silk frame or optical camera)
• Soldering: Install new BGA chip

• Watch/Mobile/Cell phone repair
• Notebook/Laptop/Computer repair
• XBOX 360/PS2/PS3/PS4/Wii game console repair
• SMD/SMT/IC BGA rework including iCloud removal
• BGA VGA, CPU, GPU, ECU and car motherboard soldering/desoldering
• BGA chips, QFP QFN chip, PC, PLCC PSP PSY rework

• Integrated hot air head and mounting head with automatic soldering/desoldering
• Independent 3-zone heating system with synchronized upper/lower heater movement
• High-precision PCB slider for accurate BGA mounting
• German-imported preheating table (500×420mm) with heat-resistant glass (up to 1800°C)
• Motor-controlled X/Y axis movement for precise alignment
• Maximum PCB size capacity: 650×610mm with no repair dead corners
• Built-in vacuum pump with 360° rotation and fine-adjustable suction nozzle
• Automatic BGA height detection with pressure control (down to 10g)

High-definition CCD color optical alignment system with HD LCD monitor

HD touch interface with 8-segment temperature control and real-time curve analysis

• Password protection against unauthorized modifications
• Dual over-temperature protection