Automatic Infrared BGA Rework Station with Digital LCD Display and Automatic Feeding for Mobile Phone IC Repair
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Brand:
WISDOMSHOW
Product Description
Automatic Infrared BGA Rework Station for Mobile Phone IC Repair
WDS-880D Main Features
Integrated hot air head and mounting head design with automatic mounting, welding, and dismantling functions
Upper air head features rapid heating system with uniform temperature distribution and fast cooling (50-80°C cooling capability), ideal for lead-free soldering processes
Lower heating zone utilizes infrared + hot air hybrid technology for fast PCB warm-up (10°C/S rate) with maintained temperature uniformity
Three independent temperature zones (upper, lower, and infrared preheating) with synchronized automatic movement
Motor-controlled lower temperature zone with vertical movement for PCB support
High-precision slider system ensures accurate BGA and PCB board placement
Original bottom preheating platform with German imported infrared gold-plated light tubes and anti-glare thermostatic glass (1800°C temperature resistance)
500 × 420mm preheating area with movable platform, clamping device, and cooling system in X-direction
Motor-controlled X,Y axis movement for fast alignment and efficient space utilization
Maximum clamping plate size of 590 × 400mm with no rework dead ends
Dual joystick control with alignment lens and heating platform for precision alignment
Built-in vacuum pump with φ angle rotation and precision fine-tuning mounting nozzle
Automatic suction and mounting height recognition with 10-gram pressure control and 0-pressure functions for smaller chips
Color optical vision system with manual X,Y movement, spectral dual-color, magnification, and fine-tuning capabilities
Chromatic aberration resolution device with auto-focus and software operation for BGA sizes up to 80 × 80mm
Various alloy hot air nozzles with 360° rotation positioning
Four temperature measurement ports for multi-point real-time monitoring and analysis
Solid-state operation display for safe and reliable temperature control
Automatic generation of SMT standard temperature disassembly curves for different environmental conditions
Optional camera for observing tin ball melting points during the soldering process
WDS-680D Technical Specifications
| Parameter | Specification |
|---|---|
| Total Power | 6000W |
| Upper Heating Power | 1600W |
| Lower Heating Power | 1600W |
| Infrared Heating Power | 4000W Total IR Power |
| Power Supply | Two-phase 220V, 50/60Hz |
| Positioning Method | V-slot PCB fixing, laser positioning, motor-controlled X,Y axis |
| Temperature Control | High-precision K-type thermocouple closed loop control (±1°C accuracy) |
| Electrical Selection | PC control system, temperature control module, motion control board, Panasonic servo, stepper drive |
| Tin Spot Monitoring | External camera for monitoring tin ball melting process (optional) |
| MES System | Reserved MES port |
| Feeding Device | Automatic feeding device |
| Maximum PCB Size | 590 × 400mm |
| Minimum PCB Size | 10 × 10mm |
| Temperature Measurement Interface | 4 ports |
| Chip Zoom Range | 2 to 80 times |
| PCB Thickness | 0.5-10mm |
| Applicable Chip Size | 0.8 × 0.8 to 90 × 90mm |
| Minimum Chip Pitch | 0.15mm |
| Maximum Mounting Load | 500g |
| Mounting Accuracy | ±0.01mm |
| Overall Dimensions | 820 × 706 × 1400mm |
| Machine Weight | Approximately 200KG |
| Other Features | Dual joystick operation, automatic & manual mode switching, 7-axis motorized motion control, dual-channel heating technology, MES port, smoke purification system |
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Company
Shenzhen Wisdomshow Technology Co.,ltd
Location
No.6,Haosi Western Industry,Shangjing Town,Bao'an District,Shenzhen,China
Contact Person
Elysia