Shenzhen Wisdomshow Technology Co.,ltd
                                                                                                           
Verified Supplier
15 Years
Since 2011
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Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair

Price Negotiable
Price: CN¥339,653.24
MOQ: 1
Delivery Time: Negotiable
Brand: Wisdomshow
Product Description
WDS-1250 Auto CCD BGA Rework Station
Full automatic BGA rework station designed for large industrial control motherboards and 5G service motherboard repair with maximum PCB size support of 1200mm × 700mm.
Application Domain
Specifically designed for large-size industrial control motherboards and 5G service motherboard repair. Features computer-controlled operations with HD optical alignment system and 3-in-1 heating technology (hot air + IR + gas including nitrogen or compressed air). Suitable for removing or soldering various chip types including POP, CCGA, BGA, QFN, CSP, LGA, Micro SMD, and MLF.
Technical Specifications
Power Supply AC 110V/220V ±10% 50/60Hz
Total Power Max 10400W
Heater Power Upper heater 1200W, bottom heater 1200W, IR heater 8000W MAX
Locating System Optical camera + V-shape card slot + adjustable PCB support jigs + laser positioning
Temperature Control High precision K-sensor (Closed Loop), ±1℃ precision
Electrical Components Servo motor + PLC control + smart temperature controller + high sensitivity touch screen IPC
PCB Size Max 1200 × 700mm, Min 10 × 10mm (customizable)
PCB Thickness 0.3-8mm
Chip Size Range Max 120 × 120mm, Min 0.6 × 0.6mm
Minimum Chip Space 0.15mm
Mounting Accuracy ±0.01mm
Alignment System Optical lens + HD industrial camera
Temperature Interfaces 13 sensors
Overall Dimensions L1350 × W1300 × H1920mm
Weight 650KG
Key Features
  • 10-axis interlock system with electric motor drive control for all movements
  • Stores over 5000 temperature profiles for high-volume motherboard rework
  • Upper heater and CCD camera can move front/back and left/right to eliminate dead angles
  • Manual flow cool down system protects chips from high temperature damage
  • Side camera for monitoring solder ball melting during process
  • High sensitivity touch screen IPC with intelligent operation system
  • Built-in vacuum pump with automatic memory function
  • Automatic nozzle height identification with precise pressure control (10 grams range)
  • 22x optical zoom with color high-definition optical system
  • Heat and mount head 2-in-1 design with auto rotation and removal functions
  • Dual-channel heating system with 80mm air outlet for fast temperature response
  • Large bottom preheater zone (720×600mm) with German infrared heating panels
  • Nitrogen inlet for protected soldering process
Product Images
WDS-1250 BGA Rework Station Front View WDS-1250 Control Panel and Display WDS-1250 Heating and Mounting System WDS-1250 Optical Alignment System WDS-1250 Bottom Preheater Zone WDS-1250 Temperature Control Interface WDS-1250 Internal Components
Packaging
WDS-1250 Packaging Overview WDS-1250 Secure Packaging
Why Choose WDS
  • Manufacturer with own factory, design team, and production facilities
  • Rich experience in BGA rework station technology
  • Product development based on customer feedback
  • OEM services available
  • 100% new products directly from WDS factory
  • Excellent quality control and inspection teams
  • Good reputation domestically and internationally
  • Free spare parts within 1 year warranty
  • Lifetime technical support and training
Business Partners
WDS Business Partner Logos International Business Partners Global Distribution Network Industry Partnerships Technical Collaborations

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Wisdomshow Technology Co.,ltd
Location No.6,Haosi Western Industry,Shangjing Town,Bao'an District,Shenzhen,China
Contact Person Elysia

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