TECircuit Capability

1. Schematic development and PCB layout(what we use is Protel, PADS)
2. PCB fabrication from 1-40 layers. (single side, double side, multi-layer, HDI board, bury and blind holes board etc)
3. Material procurement and management
4. Prototype and NPI (new product introduction)
5. PCBA (SMD Placement include 0402,QFP,QFN,BGA etc )and through hole assembly, in-circuit test and functional testing)
6. IC pre-programming and Function verification & burning test
7. Complete Unit assembly (Box building include the plastic, screen, metal enclosure, membrane, coils, wire harness etc.)
8. Environmental Coating
9. Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure and pac