IC Substrate PCB Multilayer Rigid Printed Circuit Board LGA Package ENIG Finish
Product Images
About TECircuit
Found: TECircuit has been operating since 2004.
Location: An electronics manufacturing service(EMS) provider located in Shenzhen China.
Item: Customizable EMS PCB, offers a full range of one-stop shop services.
Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.
Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.
Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly production capacity : 100,000 m2
Product Applications
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High-Performance Processors:
- Used in CPUs and GPUs for computers and servers, enabling high-speed data processing and efficient thermal management.
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Networking Equipment:
- Integrated into network processors and switches, facilitating fast data transmission and communication.
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Telecommunications:
- Employed in base stations and RF modules for mobile networks, ensuring reliable signal processing and connectivity.
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Consumer Electronics:
- Used in devices like smartphones, tablets, and smart TVs, supporting advanced features and functionalities.
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Automotive Electronics:
- Integrated into automotive control units for applications such as advanced driver assistance systems (ADAS) and infotainment.
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Medical Devices:
- Used in diagnostic and imaging equipment, where performance and reliability are critical for patient safety.
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Industrial Automation:
- Employed in programmable logic controllers (PLCs) and robotics, enhancing operational efficiency and control.
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Aerospace and Defense:
- Integrated into critical systems requiring high reliability and performance in harsh environments.
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Embedded Systems:
- Used in various embedded applications, including IoT devices and smart sensors, allowing for compact designs.
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Power Management ICs:
- Employed in power management solutions to optimize energy consumption and improve efficiency.
Product Features
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Low Profile:
- LGA packages have a low height, making them suitable for space-constrained applications.
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Excellent Thermal Performance:
- Designed for efficient heat dissipation, essential for high-performance applications.
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High Pin Count:
- Supports a large number of I/O connections, allowing for complex and versatile designs.
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Robust Mechanical Stability:
- Provides strong mechanical support during assembly and operation, enhancing reliability.
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Ease of Assembly:
- LGA packages facilitate automated assembly processes, improving manufacturing efficiency.
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Reduced Parasitic Inductance:
- Optimized for low inductance, which benefits high-frequency performance and signal integrity.
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Compatibility with Various Substrates:
- Can be used with different materials, including organic and ceramic substrates, for diverse applications.
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Enhanced Signal Integrity:
- Designed to minimize signal degradation, ensuring reliable performance in high-speed applications.
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Cost-Effectiveness:
- Suitable for mass production, reducing costs while maintaining high quality.
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Compliance with Industry Standards:
- Manufactured to meet stringent performance and safety standards, ensuring reliability in critical applications.
FAQ
Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)
Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA
Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP for our customers in the whole process. All documents from customers are never shared with any 3rd parties.
Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer provided shipment method is acceptable.
Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is acceptable.
Product Description
| Specification: | |||||
| PCB layers: | 1-42layers | ||||
| PCB materials: | CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | ||||
| PCB max. board size: | 620mm*1100mm | ||||
| PCB certificate: | RoHS Directive-Compliant | ||||
| PCB Thickness: | 1.6 ±0.1mm | ||||
| Out Layer Copper Thickness: | 0.5-5oz | ||||
| Inner Layer Copper Thickness: | 0.5-4oz | ||||
| PCB max. board thickness: | 6.0mm | ||||
| Minimum Hole Size: | 0.20mm | ||||
| Minimum Line Width/Space: | 3/3mil | ||||
| Min. S/M Pitch: | 0.1mm(4mil) | ||||
| Plate Thickness and Aperture Ratio : | 30:1 | ||||
| Minimum Hole Copper: | 20µm | ||||
| Hole Dia. Tolerance(PTH): | ±0.075mm(3mil) | ||||
| Hole dia. Tolerance(NPTH): | ±0.05mm (2mil) | ||||
| Hole Position Deviation: | ±0.05mm (2mil) | ||||
| Outline Tolerance: | ±0.05mm (2mil) | ||||
| PCB solder mask: | Black, white, yellow | ||||
| PCB surface finished: | HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver | ||||
| Legend: | White | ||||
| E-test: | 100% AOI, X-ray, Flying probe test. | ||||
| Outline: | Rout and Score/V-cut | ||||
| Inspection Standard: | IPC-A-610CCLASSII | ||||
| Certificates: | UL (E503048),ISO9001/ISO14001/IATF16949 | ||||
| Outgoing Reports: | Final Inspection, E-test, Solderability Test, Micro Section and More | ||||
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.