Embedded eMMC 5.1 with Wide Temperature Resistanc for Automotive Electronic ADAS
Price:
Negotiable
MOQ:
50pcs
Delivery Time:
10 to 15 days
Brand:
PG
Product Description
Embedded eMMC 5.1 with Wide Temperature Resistance for Automotive Electronic ADAS
PG Brand automotive-grade eMMC(from China Chips Star Semiconductor Co., Ltd.) is specifically engineered for Advanced Driver Assistance Systems (ADAS) in vehicles. PG Brand automotive-grade eMMC(from China Chips Star Semiconductor Co., Ltd.) meets the high reliability and stability storage requirements under complex vehicle operating conditions, providing a solid data foundation for driving safety and intelligent driving functions.
PG Brand automotive-grade eMMC(from China Chips Star Semiconductor Co., Ltd.) complies with the JEDEC eMMC 5.1 protocol specification and supports HS400 high-speed transmission mode, with maximum read and write speeds reaching up to 330MB/s and 240MB/s respectively.
Key Features of PG Brand automotive-grade eMMC(from China Chips Star Semiconductor Co., Ltd.)
- Efficiently processes massive real-time data from ADAS sensors including cameras, millimeter-wave radars, and lidars
- Ensures millisecond-level response for critical functions: Lane Departure Warning, Autonomous Emergency Braking, and Adaptive Cruise Control
- Wide operating temperature range of -40℃ to +105℃ for stable operation in extreme environments
- Built-in intelligent wear leveling algorithm and bad block management mechanism
- Supports up to 3000 Program/Erase (P/E) cycles with extended data retention lifespan
- Compatible with mainstream automotive-grade host control chips including Rockchip and Qualcomm
- Supports in-vehicle operating systems such as Android Automotive OS
- IATF 16949 certified and AEC-Q100 Grade 2 compliant
Technical Specifications of PG Brand automotive-grade eMMC
| Interface | eMMC 5.1 with HS400 support |
|---|---|
| Capacities | 64GB, 128GB, 256GB |
| Data Transfer Speed | Up to 400MB/s (HS400 mode) |
| Operating Voltage | 3.3V (VCC), 1.8V/3.3V (VCCQ) |
| Temperature Range | -40°C to 105°C |
| Endurance | High endurance for frequent read/write cycles |
| Security | RPMB, secure boot, and write protection |
| Package | BGA (Ball Grid Array) |
| Package Size | 11.5 x 13 x 1 mm |
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Company
China Chips Star Semiconductor Co., Ltd.
Location
Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
Contact Person
Sunny Wu