China Chips Star Semiconductor Co., Ltd.
                                                                                                           
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EMMC5.1 128GB Ultra Wide-Temperature EMMC 64GB 256GB Specialized For Rail Transit Extreme Environments

Price Negotiable
Price: Negotiable
MOQ: 50pcs
Delivery Time: 10 to 15 days
Brand: PG
Product Description
EMMC5.1 128GB Ultra Wide-Temperature EMMC 64GB 256GB -55℃ To 105℃, Specialized For Rail Transit Extreme Environments
High-performance eMMC 5.1 storage solutions engineered specifically for demanding rail transit applications, featuring ultra-wide temperature operation from -55℃ to 105℃ with capacities of 64GB, 128GB, and 256GB.
CB EMMC5.1 Specification
Model G2864GTLCB G28128TLCB G28256TLCB
NAND flash 3DTLC NAND 3DTLC NAND 3DTLC NAND
Capacity 64GB 128GB 256GB
CE 1 2 4
Read speed up to 330MB/s up to 330MB/s up to 330MB/s
Write speed up to 240MB/s up to 240MB/s up to 240MB/s
Operating temperature -25℃~85℃ -25℃~85℃ -25℃~85℃
EP ≥3000 ≥3000 ≥3000
Packaging specification BGA 153 BGA 153 BGA 153
Size 11.5mmx13mmx1.0mm 11.5mmx13mmx1.0mm 11.5mmx13mmx1.2mm
Core Architecture of eMMC - Integrated Design of "Controller + Flash Memory"
The eMMC module architecture combines sophisticated hardware and firmware design, featuring three core components: MMC controller, NAND flash memory chip, packaging substrate, and interface. Each element performs specialized functions to ensure reliable storage operation in demanding environments.
Core Brain: MMC Controller
The MMC controller serves as the command center of eMMC, processing host storage commands, managing NAND flash read/write operations, addressing flash memory physical defects, and providing data encryption and cache management capabilities.
Key Controller Functions:
  • Protocol Conversion: Translates standardized MMC interface commands from the host into NAND flash operations (page read/write, block erase), enabling seamless communication between host and flash memory.
  • Bad Block Management: Pre-detects and marks defective storage units using firmware algorithms, replacing bad blocks with redundant spare blocks to ensure data storage reliability.
  • Wear Leveling: Distributes data evenly across the entire flash memory to prevent localized wear and extend eMMC service life.
  • Data Cache and Error Correction: Features built-in SRAM cache for improved read/write speeds and integrated ECC (Error Checking and Correction) to ensure data integrity during transmission and storage.
  • Security Encryption: Supports advanced encryption protocols including AES-256 to protect stored data and meet stringent information security requirements for industrial applications.

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Company China Chips Star Semiconductor Co., Ltd.
Location Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
Contact Person Sunny Wu

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