China Chips Star Semiconductor Co., Ltd.
                                                                                                           
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7 Years
Since 2019
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Industrial EMMC 32 64 128 256GB Embedded IC For Industrial PC EMMC 5.1

Price Negotiable
Price: Negotiable
MOQ: 50pcs
Delivery Time: 2 to 5 days
Brand: PG
Product Description
Industrial eMMC Memory Solutions
Industrial-grade eMMC memory technology designed for applications requiring high reliability, durability, and extended temperature ranges. These robust memory chips deliver consistent performance in demanding industrial environments.
Industrial eMMC memory chip product overview
Capacity Recommendations
32GB
Ideal for lightweight systems, boot firmware, and configuration storage; most cost-effective solution.
64GB
Standard for mainstream industrial PCs, balances capacity and cost, suitable for most embedded systems.
128GB
Preferred for medium-to-large industrial applications, data logging, and edge AI inference.
256GB
For high data throughput, 4K video storage, big data caching, and high-end industrial servers/gateways.
Key Features
  • Wide temperature resistance: Stable operation from -40℃ to +85℃, adapts to harsh industrial environments
  • High reliability & durability: Built-in ECC, wear leveling, and power failure protection, ensuring long-term stable performance
  • High integration: Single-chip BGA design, easy to solder, reduces system design complexity
  • Stable performance: Compliant with eMMC 5.1 standard, high read/write speed and consistent IO performance
  • Wide compatibility: Suitable for industrial PCs, embedded devices, automation equipment, and IoT applications
  • Low power consumption: Energy-saving design for long-running and battery-powered devices
Industrial eMMC technical specifications and applications Industrial eMMC chip close-up and installation
IA/IH eMMC 5.1 Technical Specifications
Model G2564GTLIA G25128TLIA G25256TLIA G25512TLIA
NAND Flash 3D TLC NAND 3D TLC NAND 3D TLC NAND 3D TLC NAND
Capacity 64GB 128GB 256GB 512GB
CE 1 2 4 4
Read Speed up to 330MB/s up to 330MB/s up to 330MB/s up to 330MB/s
Write Speed up to 240MB/s up to 240MB/s up to 240MB/s up to 240MB/s
Operating Temperature -40℃~85℃/-45℃~105℃ -40℃~85℃/-45℃~105℃ -40℃~85℃/-45℃~105℃ -40℃~85℃/-45℃~105℃
EP ≥3000 ≥3000 ≥3000 ≥3000
Packaging Specification BGA 153 BGA 153 BGA 153 BGA 153
Size 11.5mm×13mm×1.0mm 11.5mm×13mm×1.0mm 11.5mm×13mm×1.2mm 11.5mm×13mm×1.2mm

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Company China Chips Star Semiconductor Co., Ltd.
Location Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
Contact Person Sunny Wu

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