eMMC 5.1 Embedded Flash Chips 32GB 64GB eMMC for TV Board
Price:
Negotiable
MOQ:
50pcs
Delivery Time:
10 to 15 days
Brand:
PG
Product Description
eMMC 5.1 Embedded Flash Chips 32GB 64GB eMMC for TV Board
This eMMC 5.1 embedded flash chip from China Chips Star is specially designed for TV boards and various embedded devices. Our eMMC 5.1 adopts the SA3636 controller with original SK Hynix NAND Flash wafer, it integrates the standard eMMC 5.1 interface and is available in 32GB and 64GB mainstream capacities. Featuring high performance, high stability and low power consumption, it is perfectly suitable for smart TV system firmware, application data storage and multimedia caching scenarios.
Core Component Advantages of eMMC 5.1
1. SA3636 Controller
- Performance Optimization: Custom-built for eMMC 5.1, supporting HS400 high-speed bus with fast burst read/write response, ideal for TV multi-tasking and high-definition video caching.
- Low Power Design: Equipped with a deep power-saving mechanism and supports low-power sleep/standby mode, matching the long-time standby and low-power operation requirements of TVs.
- TV Compatibility: Firmware optimized for TV boards (including Mstar, Amlogic, Rockchip platforms), delivering strong compatibility, fast boot-up and smooth system operation.
2. Original SK Hynix NAND Flash Wafer
- Reliable Quality: Original Hynix wafer with 3D TLC architecture, featuring mature process, excellent consistency and high yield, suitable for stable mass production and supply.
- Durable Read/Write Performance: TLC architecture combined with controller optimization, offering a minimum of 3000 P/E cycles, far exceeding daily write demands for TV system updates and application installations.
EMMC 5.1 Specification Comparison
| Model | G2532GTLCB | G2564GTLCB | G25128TLCB |
|---|---|---|---|
| NAND Flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
| Capacity | 32GB | 64GB | 128GB |
| CE | 1 | 1 | 2 |
| Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating Temperature | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ |
| EP | ≥3000 | ≥3000 | ≥3000 |
| Packaging Specification | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.0mm | 11.5mm×13mm×1.2mm |
Manufacturer: China Chips Star Semiconductor Co., Ltd.
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Company
China Chips Star Semiconductor Co., Ltd.
Location
Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
Contact Person
Sunny Wu