China Chips Star Semiconductor Co., Ltd.
                                                                                                           
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Since 2019
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256GB 128GB 64GB Industrial EMMC5.1 BGA153 EMMC Memory Chip

Price Negotiable
Price: Negotiable
MOQ: 50pcs
Delivery Time: 2 to 5 days
Brand: PG
Product Description
256GB 128GB 64GB Industrial eMMC5.1 BGA153 Memory Chip
Industrial-grade eMMC memory technology designed for applications requiring high reliability, durability, and extended temperature ranges. These robust memory chips deliver consistent performance in demanding industrial environments.
Key Features
  • High Reliability
    Engineered for harsh conditions with robust construction that ensures long-lasting performance and reduces data loss risk
  • Extended Temperature Range
    Operates in extreme temperatures (-40°C to +85°C / -45°C to +105°C), suitable for outdoor and industrial applications
  • Enhanced Endurance
    Higher write and erase cycle ratings (≥3000 EP) for applications requiring frequent data updates
  • Data Integrity Features
    Advanced error correction and wear leveling algorithms maintain data integrity and optimize memory lifespan
  • Power Loss Protection
    Safeguards against data corruption during sudden power loss for reliable data preservation
  • Compact Design
    BGA153 packaging (11.5mm x 13mm) allows efficient space utilization in embedded systems
  • Low Power Consumption
    Energy-efficient design ideal for battery-powered devices and power-critical applications
  • Easy Integration
    Compatible with various embedded systems for straightforward design integration
  • Industry Standards Compliance
    Meets or exceeds relevant certifications for automotive, medical, and telecommunications applications
  • Cost-Effective Solution
    Lower total cost of ownership in high-volume, long-term industrial applications
Industrial eMMC5.1 BGA153 memory chip product view Industrial eMMC memory chip technical specifications
IA/IH eMMC5.1 Specification
Model G2564GTLIA G25128TLIA G25256TLIA G25512TLIA
NAND Flash 3D TLC NAND 3D TLC NAND 3D TLC NAND 3D TLC NAND
Capacity 64GB 128GB 256GB 512GB
CE 1 2 4 4
Read Speed up to 330MB/s up to 330MB/s up to 330MB/s up to 330MB/s
Write Speed up to 240MB/s up to 240MB/s up to 240MB/s up to 240MB/s
Operating Temperature -40℃~85℃/-45℃~105℃ -40℃~85℃/-45℃~105℃ -40℃~85℃/-45℃~105℃ -40℃~85℃/-45℃~105℃
EP ≥3000 ≥3000 ≥3000 ≥3000
Packaging Specification BGA 153 BGA 153 BGA 153 BGA 153
Size 11.5mm×13mm×1.0mm 11.5mm×13mm×1.0mm 11.5mm×13mm×1.2mm 11.5mm×13mm×1.2mm

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Company China Chips Star Semiconductor Co., Ltd.
Location Building 7B, Huaqiang Creative Industrial Park, Guangming, Shenzhen, Guangdong, China
Contact Person Sunny Wu

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