0.7mil Silver Alloy Bonding Wire High Tech Industries Semiconductor Packaging
0.7mil Silver Alloy Bonding Wire for High-Tech Semiconductor Packaging
Designed for precision and reliability in advanced semiconductor manufacturing, our 0.7mil Silver Alloy Bonding Wire delivers exceptional electrical conductivity (≥65 MS/m) and thermal stability (-55°C to 300°C). With a ultra-fine diameter of 0.7mil (17.8μm), it enables high-density interconnects in IC packaging, MEMS devices, and power electronics, meeting the stringent demands of automotive, aerospace, and 5G industries.
When compared to traditional gold wire, our product stands out with a significantly lower cost. This cost - effectiveness is not achieved at the expense of quality. Instead, it provides a remarkable competitive advantage in terms of price. This advantage makes it an ideal choice for customers who are looking for high - quality materials without breaking the bank, especially in cost - sensitive applications.
This product is widely utilized in the packaging of ICLED. In this application, its unique combination of properties plays a vital role. It ensures the reliable operation of ICLED components by providing stable electrical connections and efficient heat management. Furthermore, it is also used in other diverse fields where similar requirements for material properties exist, such as in some high - tech manufacturing and electronics industries.
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Silver alloy Bonding Wire AG99% |
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Type |
Ø Diameter ±1% μm |
Breaking Load BL(gf) |
Elongation EL(%) |
Length Meters |
|
YF-99 |
18(0.7mil) |
>4 |
3-20 |
500/1000 |
|
99B |
20(0.8mil) |
>5 |
3-20 |
500/1000 |
|
SW-21 |
23(0.9mil) |
>7 |
3-20 |
500/1000 |
|
99A |
25(1.0mil) |
>8 |
3-20 |
500/1000 |
|
99A |
30(1.2mil) |
>11 |
3-20 |
500/1000 |
Note: The above Diameter, BL and EL parameters can be customized according to customer requirements.
Application:
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