Electronics Palladium Coated Copper Wire For Optoelectronic Packaging
Price:
999
MOQ:
1PC
Delivery Time:
5-8 WORKING DAYS
Brand:
WINNER
Product Description
Strong and Durable Palladium Coated Copper Wire for Optoelectronic Packaging
Material and Composition of the Bonding Wire
Our gold - plated/palladium bonding wire is crafted with precision from 4N high - purity copper material. This copper is of an exceptional quality, with a purity level that ensures its fundamental reliability and excellent electrical conductivity. But it doesn't stop there. We have also incorporated a certain proportion of trace elements into this copper base. These trace elements are added in a carefully controlled manner, as they play a vital role in enhancing the overall performance of the bonding wire. Each trace element has been selected based on extensive research and experimentation to bring out specific desired properties.
Our gold - plated/palladium bonding wire is crafted with precision from 4N high - purity copper material. This copper is of an exceptional quality, with a purity level that ensures its fundamental reliability and excellent electrical conductivity. But it doesn't stop there. We have also incorporated a certain proportion of trace elements into this copper base. These trace elements are added in a carefully controlled manner, as they play a vital role in enhancing the overall performance of the bonding wire. Each trace element has been selected based on extensive research and experimentation to bring out specific desired properties.
Unique Characteristics
This bonding wire not only inherits the characteristics of conventional copper wire but also exhibits a series of remarkable additional features. Firstly, it has high strength. This means that it can withstand significant mechanical stress during various manufacturing processes and in its actual application environment. Whether it's during the wire - bonding operation in IC packaging or when subjected to external forces in the long - term usage, its high strength ensures that it remains intact and functional.
Application in IC Packaging
This surface gold/palladium special bonding wire has been specifically developed for IC packaging. In the complex and demanding world of integrated circuit manufacturing, the quality of the bonding wire can have a significant impact on the performance and reliability of the final product. Our wire's unique combination of properties makes it an ideal choice for connecting different components within the IC. It provides stable electrical connections, withstands the mechanical stress during the packaging process, and remains resistant to oxidation, arcs, and corrosion over the long term. This ensures that the integrated circuit functions optimally and has a long - term stable performance, meeting the high - quality requirements of modern electronics manufacturing.
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Pd Coated Copper Wire |
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Type |
Ø Diameter ±1% μm |
Breaking Load BL(gf) |
Elongation EL(%) |
Length Meters |
|
PW-1 |
18(0.7mil) |
>4 |
8-14 |
500/1000/2000 |
|
20(0.8mil) |
>5 |
9-15 |
500/1000/2000 |
|
|
23(0.9mil) |
>7 |
10-17 |
500/1000/2000 |
|
|
25(1.0mil) |
>9 |
11-17 |
500/1000/2000 |
|
|
30(1.2mil) |
>14 |
14-22 |
500/1000/2000 |
|
Note: The above Diameter parameters can be customized according to customer requirements.
Application:
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang