Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies
Price:
999
MOQ:
1PC
Delivery Time:
5-8 WORKING DAYS
Brand:
WINNER
Product Description
Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies
Winner offers a wide selection of ball, wedge and stud bonding wires in a varied portfolio of 5N 99.999 / 4N 99.99 / 3N 99.9 / 2N 99.0.
* Raw materials of high purity (99,999 %)
* Stable mechancial qualities
* Wire surface of high quality
* Made according to customer specifications
* With a diameter down to a size of 0.6 mils / 15 microns for very fine applications.
* For ball or wedge bonding or stud bumping
Gold bonding wire offers several advantages over other types of wire. Winner can control the diameter of gold bonding wires depending on the customers’ requests. Winner is a leading supplier of metallic bonding wires.
The gold bonding wire is a kind of material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. Winner can provide Au bonding wire with different wire diameters from 10um-40um according to customer requirements.
Physical Properties
|
Density:
|
19.34 g/cm3
|
|
Melting Point:
|
1063°C
|
|
Electrical Resistivity: (@20°C)
|
2.3 μΩ-cm
|
|
Electrical Conductivity: (@20°C)
|
75% (IACS)
|
|
Thermal Conductivity: (@20°C)
|
315 W/(m-K)
|
|
Fusing Current (10 mm x 25 μm)
|
0.52 A
|
We take pride in offering a complete range of wire diameters, thereby fulfilling the diverse needs for strength and elongation in different wire applications. Moreover, we collaborate closely with our customers to provide customized solutions. In these custom solutions, technical parameters such as tensile strength and elongation are meticulously tailored to meet their specific requirements. This customer-centric approach enables us to not only meet but exceed the expectations of our clients in the highly competitive market of wire manufacturing and bonding applications.
|
Composition
|
Diameter
|
Tensile Strength (gms)
|
Elongation (%)
|
|
|
99.99% Au
|
0.7 mil
|
17.5 μm
|
3 - 10
|
2 - 6
|
|
0.8 mil
|
20 μm
|
4 - 13
|
2 - 7
|
|
|
0.9 mil
|
22.5 μm
|
5 - 16
|
2 - 8
|
|
|
1.0 mil
|
25 μm
|
6 - 20
|
2 - 8
|
|
|
1.3 mil
|
32.5 μm
|
10 - 45
|
2 - 10
|
|
|
1.5 mil
|
37.5 μm
|
13 - 50
|
2 - 12
|
|
|
1.7 mil
|
42.5 μm
|
15 - 60
|
2 - 12
|
|
|
1.8 mil
|
45 μm
|
20 - 70
|
2 - 12
|
|
|
2.0 mil
|
50 μm
|
25 - 85
|
2 - 15
|
|
|
3.0 mil
|
75 μm
|
50 - 180
|
2 - 20
|
|
Why Gold Bonding Wire?
Gold (Au) bonding wire is used in a wide range of applications rangining from high pin-count, ultra-fine pitch microelectronic devices to high-power discrete components. Au is the preferred choice of bonding material when a) the contact material is not compatible with Aluminum (Al) and/or Copper (Cu) b) the contact area is limited c) the device will be subject to high temperature or high humidity environments.
The Advantages of Gold Bonding Wire:
• Extreme bond reliability
• A wide processing window
• Low-impact ball and wedge bonding
• Superior looping performance
• High tensile test performance
• Excellent corrosion resistance
• Higher fusing current than standard Al bond wire.
Related Videos
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang



