0.01mm Ultra Fine Palladium Plated Copper Wire Flexible Solution for High Density Circuit Board Interconnects
Price:
999
MOQ:
1PC
Delivery Time:
5-8 WORKING DAYS
Brand:
WINNER
Product Description
0.01mm Ultra Fine Palladium Plated Copper Wire Flexible Solution for High Density
Circuit Board Interconnects
Discover our 0.01mm ultra fine palladium plated copper wire, a revolutionary solution for high density circuit board interconnects. Its ultra - fine diameter allows for maximum packing density on circuit boards, enabling more components to be integrated into a limited space.
The palladium plating offers excellent corrosion resistance, which extends the wire's lifespan and ensures stable performance over time. What truly sets it apart is its flexibility. This wire can be easily bent and shaped during the assembly process, adapting to complex circuit layouts without breaking.
Whether used in consumer electronics or advanced industrial equipment, it provides reliable electrical connections, making it an ideal choice for high - density circuit board applications.
Palladium-Coated Copper (PCC) bonding wire was developed and has now become the most dominant bonding material used in fine wires of diameters of <50 microns being used as substitute for more expensive gold. Thermosonic wire bonding is the most popular form of interconnection for most semiconductors. It requires the creation of a molten Free-Air Ball (FAB) at the end of the wire that is then ultrasonically-pressed on semiconductor bonding pads to form the first bond
| Features: |
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* Gold-plated/palladium bonding wire made of 4N high-purity copper material with a certain proportion of trace elements added;
* In addition to the characteristics of conventional copper wire, it also has high strength,low curvature, high toughness, and anti-oxidation
* Chemical characteristics, the arc isimpact-resistant and the welding wire is corrosion-resistant;
* Surface gold/palladium special bonding wire developed for IC packaging;
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What Is Palladium Coated Copper Bonding Wire?
Palladium Coated Copper Bonding Wire is easier to bond than your standard bare copper wire. The Palladium (Pd) coating allows for high performance and stable bonding, all within a wider bonding. The Pd coating controls the oxidation build up that can occur on the surface of the copper wire.
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Pd Coated Copper Wire |
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Type |
Ø Diameter ±1% μm |
Breaking Load BL(gf) |
Elongation EL(%) |
Length Meters |
|
PW-1 |
18(0.7mil) |
>4 |
8-14 |
500/1000/2000 |
|
20(0.8mil) |
>5 |
9-15 |
500/1000/2000 |
|
|
23(0.9mil) |
>7 |
10-17 |
500/1000/2000 |
|
|
25(1.0mil) |
>9 |
11-17 |
500/1000/2000 |
|
|
30(1.2mil) |
>14 |
14-22 |
500/1000/2000 |
|
Note: The above Diameter parameters can be customized according to customer requirements.
Application:
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Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang