Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications
Price:
999
MOQ:
1PC
Delivery Time:
5-8 WORKING DAYS
Brand:
WINNER
Product Description
Ultra Thin High Conductivity 15 Micron Palladium Coated Copper Wire for Advanced Semiconductor Chip Packaging and Precision Electronics Applications
The Ultra-Thin High-Conductivity 15-Micron Palladium Coated Copper Wire revolutionizes advanced semiconductor and electronics manufacturing. Engineered with a precision 15μm diameter (1/5th of human hair), this wire delivers gold-level conductivity while offering 30% higher wear resistance than traditional gold wires, ensuring stable signal transmission in high-frequency chip packaging. Its palladium alloy coating enhances oxidation resistance, critical for 5G, AIoT, and aerospace-grade microchips exposed to extreme environments.
Ideal for fine-pitch bonding in CPU/GPU packaging, MEMS sensors, and medical device modules, it supports ≤40μm pad spacing with zero short-circuit risks. Compliant with ISO 14644-1 Class 5 cleanroom standards, it minimizes ion contamination for automotive-grade semiconductor reliability.
Ideal for fine-pitch bonding in CPU/GPU packaging, MEMS sensors, and medical device modules, it supports ≤40μm pad spacing with zero short-circuit risks. Compliant with ISO 14644-1 Class 5 cleanroom standards, it minimizes ion contamination for automotive-grade semiconductor reliability.
As a cost-efficient gold alternative, it reduces material costs by 60% without compromising performance. Trusted by global top-tier fabs, this wire combines cutting-edge nano-coating technology with industrial durability, empowering next-gen electronics miniaturization and sustainable production.
- Gold-plated/palladium bonding wire made of 4N high-purity copper material with a certain proportion of trace elements added;
- In addition to the characteristics of conventional copper wire, it also has high strength,low curvature, high toughness, and anti-oxidation Chemical characteristics, the arc isimpact-resistant and the welding wire is corrosion-resistant;
- Surface gold/palladium special bonding wire developed for IC packaging;
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Pd Coated Copper Wire |
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Type |
Ø Diameter ±1% μm |
Breaking Load BL(gf) |
Elongation EL(%) |
Length Meters |
|
PW-1 |
18(0.7mil) |
>4 |
8-14 |
500/1000/2000 |
|
20(0.8mil) |
>5 |
9-15 |
500/1000/2000 |
|
|
23(0.9mil) |
>7 |
10-17 |
500/1000/2000 |
|
|
25(1.0mil) |
>9 |
11-17 |
500/1000/2000 |
|
|
30(1.2mil) |
>14 |
14-22 |
500/1000/2000 |
|
Note: The above Diameter parameters can be customized according to customer requirements.
Application:
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Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang