Customizable Ultra Fine Gold Bonding Wire for Inner Lead Packaging in Integrated Circuits and Semiconductor Separators
Price:
999
MOQ:
1PC
Delivery Time:
5-8 WORKING DAYS
Brand:
WINNER
Product Description
Customizable Ultra Fine Gold Bonding Wire for Precision IC & Semiconductor Packaging
Our high-purity gold bonding wire is specially engineered for inner lead packaging in advanced integrated circuits (ICs) and semiconductor separators. With diameters customizable from 15μm to 50μm, it delivers exceptional electrical conductivity, thermal stability, and bond strength for microelectronic assemblies.
Key Benefits:
* Tailored Diameters – Optimized for fine-pitch bonding in BGA, QFN, and CSP packages
* 99.99% Au Purity – Minimizes ionic contamination in sensitive semiconductor environments
* Superior Loop Control – Enables consistent wedge/ball bonds in automated processes
* Industry Compliance – Meets MIL-STD-883 and JEDEC J-STD-006 standards
Critical Applications:
* High-density IC interconnects
* MEMS sensor packaging
* Power semiconductor modules
Physical Properties
|
Density:
|
19.34 g/cm3
|
|
Melting Point:
|
1063°C
|
|
Electrical Resistivity: (@20°C)
|
2.3 μΩ-cm
|
|
Electrical Conductivity: (@20°C)
|
75% (IACS)
|
|
Thermal Conductivity: (@20°C)
|
315 W/(m-K)
|
|
Fusing Current (10 mm x 25 μm)
|
0.52 A
|
We take pride in offering a complete range of wire diameters, thereby fulfilling the diverse needs for strength and elongation in different wire applications. Moreover, we collaborate closely with our customers to provide customized solutions. In these custom solutions, technical parameters such as tensile strength and elongation are meticulously tailored to meet their specific requirements. This customer-centric approach enables us to not only meet but exceed the expectations of our clients in the highly competitive market of wire manufacturing and bonding applications.
|
Composition
|
Diameter
|
Tensile Strength (gms)
|
Elongation (%)
|
|
|
99.99% Au
|
0.7 mil
|
17.5 μm
|
3 - 10
|
2 - 6
|
|
0.8 mil
|
20 μm
|
4 - 13
|
2 - 7
|
|
|
0.9 mil
|
22.5 μm
|
5 - 16
|
2 - 8
|
|
|
1.0 mil
|
25 μm
|
6 - 20
|
2 - 8
|
|
|
1.3 mil
|
32.5 μm
|
10 - 45
|
2 - 10
|
|
|
1.5 mil
|
37.5 μm
|
13 - 50
|
2 - 12
|
|
|
1.7 mil
|
42.5 μm
|
15 - 60
|
2 - 12
|
|
|
1.8 mil
|
45 μm
|
20 - 70
|
2 - 12
|
|
|
2.0 mil
|
50 μm
|
25 - 85
|
2 - 15
|
|
|
3.0 mil
|
75 μm
|
50 - 180
|
2 - 20
|
|
Why Gold Bonding Wire?
Gold (Au) bonding wire is used in a wide range of applications rangining from high pin-count, ultra-fine pitch microelectronic devices to high-power discrete components. Au is the preferred choice of bonding material when a) the contact material is not compatible with Aluminum (Al) and/or Copper (Cu) b) the contact area is limited c) the device will be subject to high temperature or high humidity environments.
The Advantages of Gold Bonding Wire:
• Extreme bond reliability
• A wide processing window
• Low-impact ball and wedge bonding
• Superior looping performance
• High tensile test performance
• Excellent corrosion resistance
• Higher fusing current than standard Al bond wire.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang




