High Tensile Strength Palladium Coated Copper Bonding Wire For Semiconductor
Palladium Coated Copper Bonding Wire is easier to bond than your standard bare copper wire. The Palladium (Pd) coating allows for high performance and stable bonding, all within a wider bonding. The Pd coating controls the oxidation build up that can occur on the surface of the copper wire.
The Pd coating also extends the Highly Accelerated Stress Test (HAST) reliability. It prevents corrosion of the bonded wire span against halide attack from moulding compounds.
When using PCC bonding wire, you can be sure of excellent reliability, high performance and stable bonding. Ensure to use grounded wire bonding equipment when using PCC bonding wire. Also available in CLR2-2AT, contact our team should you require a quote for this.
- Enhanced bonding performance and stability
- Superior oxidation control on copper surface
- Extended HAST (Highly Accelerated Stress Test) reliability
- Corrosion protection against halide attack from molding compounds
- Wider bonding parameter window
- High bonding reliability is obtained by stable palladium distribution to FAB surface layer
- High and stable stitch bondability
- Wide bonding window
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