Precision Gold Coated Silver Wire Supplier | Ultra Fine Bonding Wire For Microelectronics
Price:
999
MOQ:
1000m
Delivery Time:
5-8 days
Brand:
WINNER
Product Description
Ultra Fine Bonding Wire for Microelectronics
| Parameter | Specification |
|---|---|
| Material | Silver Core + Gold Plating |
| Diameter | 15 μm / 18 μm / 20 μm / 25 μm |
| Gold Thickness | 0.05 – 0.5 μm |
| Tensile Strength | Customizable |
| Elongation | ≥ 3–10% |
| Surface | Smooth / Clean |
| Packaging | Spool / Vacuum Packing |




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Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang