0.01mm Ultra Fine Silver Bonding Wire High Strength Semiconductor Interconnect Wire
Price:
999
MOQ:
1PC
Delivery Time:
5-8 WORKING DAYS
Brand:
WINNER
Product Description
0.01mm Ultra Fine Silver Bonding Wire High Strength Semiconductor Interconnect Wire
High tensile strength, not easy to break, widely used as connecting wire for common semiconductor devices.
Product Description
Silver (Ag) alloy bonding wires have excellent electrical and thermal conductivity. They are also effective wires for optical semiconductor devices such as LEDs as they have high reflectivity in the visible spectrum. In addition, as an alternative material for gold (Au) wires, costs can be reduced by approximately 80%.
Features
- Reduce material cost with good bondability
- High reflectivity in short wavelength range
- Low Resistivity (SEC Type)
- Soft FAB (SEC type)
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Company
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Location
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Contact Person
Jiang