In the fast-paced world of printed circuit board (PCB) manufacturing, this high-speed automatic copper plating line with barrel plating style offers a revolutionary electroplating solution. Designed for efficiency and precision, this advanced system enhances production processes with its combination of speed, automation, and quality output.

Engineered with state-of-the-art technology, this plating line significantly increases PCB production throughput. The optimized conveyor system maintains quality while processing PCBs at accelerated speeds, helping manufacturers meet tight deadlines.

Fully automated with programmable logic controllers (PLCs) that precisely regulate plating time, current density, temperature, and chemical concentration. Adjustable parameters ensure consistent, high-quality results for different PCB designs.

Multiple small-to-medium PCBs are evenly exposed to plating solution in a rotating barrel. This corrosion-resistant system ensures uniform copper deposition while maximizing solution efficiency.

Advanced plating nozzles and real-time sensors guarantee accurate, uniform copper deposition. Immediate adjustments maintain consistent plating thickness and quality throughout production.

Built with corrosion-resistant stainless steel and high-quality components to withstand harsh electroplating environments. Designed for reliability with straightforward maintenance and minimal downtime.

• Customized Support: OEM and ODM services available
• Origin: China
• Refrigerant: Environmentally friendly
• Test Report: Provided with equipment