Shenzhen Gracyfiber Technology Co., Ltd.
                                                                                                           
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Ultra Low Loss High Precision FAU Fiber Array Unit For Silicon Photonics PIC CPO Optical Module 400G 800G 1.6T

Price Negotiable
Price: Negotiable
MOQ: 1pieces
Delivery Time: 5-8 work days
Brand: Gracyfiber
Product Description

Ultra Low Loss High Precision Fiber Array Unit FAU For Silicon Photonics PIC CPO Optical Module 400G 800G 1.6T SM MM Coupling Solution 

1. Product Overview

  Gracyfiber's high-precision fiber arrays provide ultra-reliable, low-loss optical coupling solutions for next-generation silicon photonics and high-speed optical modules (400G/800G+). Designed to meet the demanding requirements of high-density optical interconnects, our fiber arrays support arrangements of up to 128 single-mode or multimode fibers with sub-micron spacing accuracy. By offering extensive customization options—from material choices (quartz, silicon, Pyrex) to various grinding angles and lidless options—we provide device-level solutions that directly help you reduce active alignment time, improve packaging yield, and accelerate time-to-market for your advanced photonic integrated circuits (PICs) and co-packaged optics (CPO) products.

2. Product Features (Key Features)
Parameter Unit 1 2 4 8 12 16 24 32 48 64 96 128
Wavelength nm 460,630,780,850,980,1060,1310,1550,1650,1950
Materials - Pyrex, Tempax, Quartz, Silicon
Lid Option   Lid / Lidless
CorePitch - - 250 127/250 127/250 127/250 127 127 127 127 127 127 127
Core Pitch Tolerance μm +/-0.3 +/-0.5 +/-0.7 +/-1.0
Polish Angle Degree 8°,41°,82°,90° or customized (12°, 21°,...)   (±0.5°)
 Angle Type - A Type or  V Type
Insertion Loss dB ≤0.5(Typical 0.3) 
Return Loss dB UPC≥45, APC≥55
FA Dimension  W mm 2.5 2.5 2.5 2.5 3.5 3.5 5.7 5.7 9 10 15 19.2
H mm 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5
L mm 10 10 10 10 10 12 12 12 12 12 15 18
- - Standard or Customized
Fiber Type - OM1/OM2/OM3/OM4/OM5/G67A1/ A2/ B3 or  Customized
Fiber Coating um 250 µm / 900 µm loose tube / ribbon (optional)
 Fiber Type Length cm 100+/-10   or customized
Connector - .FC/LC/SC/E2000/MT/MPO/MMC
Operation Temperature °C -5~65
Storage Temperature °C -40~85
Features:Ultra-low insertion loss (≤ 0.5dB, typical 0.3dB) and high return loss (APC ≥ 55dB) Benefit:Maximizes your optical power budget and ensures superior signal integrity. This is crucial for extending link distances and reducing bit error rates in 400G/800G coherent networks.
Features:Submicron-level fiber pitch tolerance (down to +/- 0.3 μm) Benefit:Ensures seamless, high-yield automated active alignment with silicon photonics chips, significantly breaking manufacturing bottlenecks, reducing alignment time, and lowering overall production costs.
Features:High channel scalability (supports 1 to 128 channels) Benefit:Provides assurance for your future hardware architecture evolution. Whether it's simple end-face interconnects or high-density cabling for complex co-packaged optics (CPO) and 1.6T modules, you can smoothly upgrade your product line by relying on a single reliable supplier.
Features:Customizable grinding angles (8°, 41°, 82°, 90° or custom) and a variety of material options Benefit:Provides ultimate mechanical and optical design flexibility. You can precisely customize the grinding angle to completely eliminate back reflections and maximize optical coupling efficiency for specific optical module housing internal space constraints.
Features:Diverse termination and connector options (MT, MPO, MMC, LC, SC) Benefit:Enables seamless plug-and-play integration with existing high-density data center ecosystems, eliminating cumbersome secondary termination processes and effectively reducing your assembly steps and labor costs.
3. Applications
  • High-speed optical modules (Optical Transceivers): Core optical components for assembling 100G, 400G, 800G, and the emerging 1.6T modules.
  • Silicon Photonics (SiPh): Enables edge coupling and grating coupling in photonic integrated circuits (PICs).
  • Co-Packaged Optics (CPO): Used for high-density optical I/O routing near ASIC switching chips.
  • Passive Optical Components: Deeply integrated into wavelength selective switches (WSS), arrayed waveguide gratings (AWG), and optical splitters.
  • Data Center Interconnect (DCI): A fundamental solution for high-density backbone connectivity.
4. Packaging Options

  We offer extremely flexible packaging and delivery configurations to perfectly match your production line process requirements:

  • Pigtailed
  • FAU
  • Hermetic
  • Lidless
  • Hybrid Integration Ready

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Gracyfiber Technology Co., Ltd.
Location 4/F,Building D ,ZhiXuanHan Yuanling Industrial Park,ShiYan Sub-District,Baoan District,Shenzhen City,Guangdong Province,China
Contact Person Joyce

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