Process Flow:

Coarse grinding→Expansion→Desmear→Three-Stage Washing→Neutralization→Second-Stage Washing→Degreasing→Dilute Pickling→Second-Stage Sashing→Micro-Etching→Pre-Soaking→Activation→Second-Stage Washing→Accelerating→First-Stage Washing→Sinking Copper→Secondary Washing→Plate Surface Plating→Small Grinding→Copper Inspection

Origin: China

Maximum Board Size:610mm X 1100mm

Board Thickness: 0.2-6.0mm

Maximum Copper Thickness: 12oz

Minimum Mechanical Aperture: 0.15mm

Number of Layers: 2-30 L

Minimum Line Width & Spacing: 3/3mil

Impedance Control: +/-10%

Maximum Plate Thickness Aperture Ratio: 10:01