Professional Custom HDI PCB ISO/IPC Certificated:

Professional custom high-density interconnect PCB engineered for Bluetooth headset control modules. Featuring 4/6-layer FR-4 base, BGA compatibility and ENIG plating, our tailor-made boards offer exceptional signal integrity, anti-interference and long-term reliability. ISO/IPC compliant, fully customizable specs to fit miniaturized wireless audio applications.

Why Choose Us:
✔ 30 Years’ Rigid-Flex & HDI PCB Expertise 

✔ ISO 9001/RoHS/ISO/TS16949 Certified Quality

✔ Custom 4/6-Layer FR-4 HDI Boards | ENIG | BGA Ready

✔ DFM & Impedance Simulation Engineering Support

✔ Global Express Shipping (DHL/FedEx/UPS) to US, EU, JP & AU

Custom HDI Advantages:

Production Process:

1.Requirement Confirmation & Gerber Audit: Review customer Gerber files, BOM and technical inquiries; finalize all custom specifications including layer count, base material, ENIG surface finish, BGA layout, and HDI micro/blind/buried via requirements.
2. DFM Analysis & RF Impedance Simulation: Conduct professional Design for Manufacturability (DFM) check and impedance simulation.
3. Material Preparation & HDI Inner Layer Production: Prepare qualified FR‑4 raw materials and fabricate HDI inner layers with precise imaging, etching, and AOI inspection.
4. Multilayer Lamination & Outer Layer Processing: Perform layer lamination for 4/6-layer boards, followed by outer layer imaging, etching, and desmear processing.
5. ENIG Surface Treatment & Profile Milling: Apply ENIG (Electroless Nickel Immersion Gold) surface finish for better solderability and oxidation resistance; rout the board to custom outline and dimensions.
6. Electrical & Reliability Verification: Run electrical continuity/insulation test, impedance test, flying probe test, and reliability checks to meet IPC and customer quality standards.
7. Final Inspection, Packaging & Global Delivery: Complete final visual and dimensional inspection, conduct ESD‑safe packaging, and arrange global express shipment via DHL/FedEx/UPS.