OSP Surface Highly Flexible PCB with 0.075mm Mini Line Width for Medical Equipment
Price:
Based on Gerber Files
MOQ:
Sample,1 pc(5 square meters)
Delivery Time:
NA
Brand:
Flexible PCB Board
Product Description
OSP Surface 2 Layer Flexible PCB Board Customized Size for Medical Equipment
2 Layers Flexible Printed Circuit Board (FPC) for Medical Equipment
A Flexible Printed Circuit Board (FPC), also known as a flexible circuit, is a specialized type of printed circuit board constructed from flexible, bendable insulating substrates. Unlike rigid PCBs (RPCBs) that rely on inflexible materials like fiberglass-reinforced epoxy (FR-4), FPCs leverage malleable substrates to enable dynamic shaping, folding, or rolling—making them ideal for electronic devices where space constraints, weight reduction, or mechanical flexibility are critical.
Product Features
- Product Name: Flexible PCB Board
- Size: Customized
- Application: Electronic Devices, Medical Equipment, Automotive Industry
- Mini Line Width: 0.075mm
- Standard: IPC Standard
- Layer Count: 1-30 layer
Technical Parameters
| Parameter | Specification |
|---|---|
| Dimension | Customized |
| Insulation Materials | Organic Resin |
| Board Type | Flexible PCB |
| Service | One Stop Turnkey Service |
| Flexibility | Highly Flexible |
| Application | Electronic Devices, Medical Equipment, Automotive Industry |
| Mini Line Width | 0.075mm |
| Surface Treatment | OSP |
| Process | Immersion Gold |
| Legend Color | White |
Applications
- Consumer Electronics: Smartphones (display/touchscreen connections, camera modules), tablets, laptops (keyboard/trackpad links), smartwatches, earbuds, and gaming controllers.
- Automotive Electronics: Infotainment systems, dashboard displays, LED lighting, sensor connections (e.g., for ADAS—Advanced Driver Assistance Systems), and battery management systems (BMS).
- Medical Devices: Flexible endoscopes, wearable health monitors (e.g., heart rate sensors), implantable devices (e.g., pacemakers), and diagnostic equipment (e.g., ultrasound probes).
- Aerospace & Defense: Satellite components, avionics (e.g., cockpit displays), and military gear (where vibration resistance and compactness are critical).
- Industrial Equipment: Robotic arms (flexible connections for moving parts), industrial sensors, and control panels.
Future Trends
High-Density Interconnects (HDIs): Smaller vias and finer trace widths (down to 25μm) to support more complex circuits in tiny spaces.
Eco-Friendly Materials: Development of recyclable or biodegradable substrates to reduce environmental impact.
Integration with Sensors: Embedding flexible sensors (e.g., pressure, temperature) directly into FPCs for smart textiles, medical wearables, and IoT devices.
5G & High-Speed Signals: Optimized FPC designs to minimize signal loss for 5G-enabled devices and high-frequency applications (e.g., radar systems).
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Company
Dongguan Xingqiang Circuit Board Technology Co., Ltd.
Location
Zhupingsha Industrial Zone, Wangniudun Town, Dongguan City, Guangdong Province
Contact Person
Kevin