ENIG OSP Flexible PCB Assembly Rigid Flex FPCB 2-48 Layers 260°C Heat Resistance Custom Design
Price:
negotiable
MOQ:
1unit
Delivery Time:
7-14 working days
Brand:
Ring or support OEM
Product Description
ENIG OSP Flexible Printed Circuit Board Assembly
Product Features
- Ultra-Thin & Lightweight - Ideal for space-constrained applications
- High Flexibility - Withstands repeated bending, folding, or twisting while maintaining electrical integrity
- Customizable Design - Tailored layouts, shapes, and layers to meet unique requirements
- High Reliability - Advanced materials (PI/PET) ensure durability in extreme conditions
- Heat Resistance - Operates efficiently in high-temperature environments up to 260°C
- Cost-Effective - Streamlined production processes reduce assembly complexity
Custom FPCB Applications
We support customization of various FPCB types including:
- Flex Fitness Trackers PCB
- Flex LED Lighting Strips PCB
- Flex Touchscreens PCB
- Flex Battery Management Systems PCB
- Flex Displays PCB
Production Timeline: Sample production within 7 working days, mass production and delivery within 15 working days
Industry Applications
| Industry | Applications |
|---|---|
| Consumer Electronics | Smartphones, tablets, wearables, digital cameras |
| Automotive Electronics | Sensors, displays, navigation systems, ADAS |
| Medical Devices | Implantable devices, diagnostic equipment, health monitors |
| Aerospace & Defense | Aircraft avionics, satellites, communication devices |
| Industrial Equipment | Robotics, automation systems, industrial IoT devices |
| Telecommunications | Base stations, routers, antennas, high-frequency components |
Manufacturing Capabilities
Advanced Engineering for Precision PCB Manufacturing
- High-Density Stack-Up: 2-48 layer boards with blind/buried vias
- 3/3mil trace/spacing with ±7% impedance control
- Smart Manufacturing with LDI laser exposure and vacuum lamination
- IPC-6012 Class 3 standards compliance
Integrated PCBA Services
- Full Assembly Support: PCB fabrication + component sourcing + SMT assembly + functional testing
- DFM/DFA Optimization to reduce design risks and BOM costs
- Rigorous Quality Control: X-ray inspection, AOI testing, 100% functional validation
Quality Assurance & Certifications
- Vertical Integration: Raw material procurement to testing fully managed in-house
- Triple Quality Assurance: AOI + impedance testing + thermal cycling
- Defect rate
- Global Certifications: ISO9001, IATF16949 and RoHS compliance
17 Years of Excellence | Self-Owned Factory | End-to-End Technical Support
Contact Information: Email info@ringpcb.com for professional solutions and one-on-one service
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Ring PCB Technology Co.,Limited
Location
Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person
Michelle Law