FR4 High Frequency PCB Assembly 2-40 Layer Custom Boards with 1-100+ GHz Range and 0.2-6.4mm Thickness
Price:
negotiable
MOQ:
1unit
Delivery Time:
7-14 working days
Brand:
Ring or support OEM
Product Description
High-Frequency PCB Overview
High-frequency PCBs are engineered to operate at frequencies exceeding 500MHz, delivering minimal signal loss and distortion for critical applications including RF communication, microwave technology, and high-speed digital circuits.
Key Advantages
Improved Signal Integrity
Minimizes signal loss and distortion for clear, accurate data transmission in telecommunications and data applications.
Lower Dielectric Loss
Utilizes materials with low dielectric constants and loss tangents to reduce energy loss during transmission.
High Thermal Stability
Withstands elevated temperatures without degradation, maintaining reliability in demanding applications.
Precise Impedance Control
Enables precise impedance control critical for maintaining signal quality in RF and microwave applications.
Excellent EMC Performance
Material characteristics minimize electromagnetic interference and enhance signal integrity.
Custom Design Capabilities
We customize all PCB types with flexible layer structures, material selection, and form factors to match your specific requirements. Sample production within 7 working days and mass production delivery within 15 working days.
Technical Specifications
| Parameter | Specification |
|---|---|
| Material | PTFE, Rogers RT/duroid®, Nelco N4000 series, Isola FR408HR |
| Dielectric Constant (Dk) | 2.2-10.2 (frequency-dependent) |
| Loss Tangent (Df) | ≤0.0015 @ 10 GHz |
| Frequency Range | 1 GHz-100+ GHz (supports mmWave, sub-THz) |
| Impedance Control | 50 Ω, 75 Ω (±5% tolerance) |
| Insertion Loss (IL) | ≤0.5 dB/inch @ 10 GHz |
| Return Loss (RL) | ≥15 dB @ 10 GHz |
| Layer Count | 2-40 layers (multi-layer configurations) |
| Board Thickness | 0.2-6.4 mm (customizable) |
| Minimum Line/Space | 3-5 mil (0.076-0.127 mm) |
| Surface Finish | HASL, ENIG, Immersion Silver, OSP |
Engineering Expertise
Our team addresses high-frequency PCB challenges including signal integrity, material selection, thermal management, complex layer stack-ups, manufacturing precision, and electromagnetic interference mitigation.
Applications
5G & Wireless Infrastructure
5G base stations (24-100 GHz mmWave), satellite communication, Wi-Fi 6E/Bluetooth devices
Automotive Electronics
77-81 GHz radar for ADAS, V2X connectivity, GPS/navigation modules
Medical Technology
MRI RF coils, radiofrequency ablation devices, wireless health sensors
Consumer Electronics
Smartphones, VR/AR headsets, gaming consoles
Industrial & Energy
High-frequency test instruments, wireless charging, IIoT sensors
Why Choose Our High-Frequency PCBs?
• Engineered for 1 GHz-100+ GHz performance
• Low-loss materials (PTFE/Rogers) for signal integrity
• Customizable for size, frequency, and environmental demands
Company Capabilities
17 Years of Excellence | Self-Owned Factory | End-to-End Technical Support
Advanced Engineering for Precision PCB Manufacturing
High-density stack-up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial control, medical devices, and automotive electronics.
Integrated PCBA Services | One-Stop Turnkey Solutions
Full assembly support: PCB fabrication + component sourcing + SMT assembly + functional testing with DFM/DFA optimization and rigorous quality control.
Self-Owned Factory with Full Supply Chain Control
Vertical integration with triple quality assurance: AOI + impedance testing + thermal cycling, defect rate
Contact us at info@ringpcb.com for professional solutions and one-on-one service from our expert team.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Ring PCB Technology Co.,Limited
Location
Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person
Michelle Law