Ring PCB Technology Co.,Limited
                                                                                                           
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18 Years
Since 2008
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Custom HDI PCB 40 Layers with 3/3mil Trace/Spacing | PCBA Turnkey Solutions for Industrial Electronics

Price Negotiable
Price: negotiable
MOQ: 1unit
Delivery Time: 7-14 working days
Brand: Ring or support OEM
Product Description
HDI PCB Technology Overview
Custom HDI PCB manufacturing facility and technology overview

High-Density Interconnect (HDI) PCBs feature advanced wiring density with micro-vias, blind/buried vias, and laser-drilled technology for complex electronic designs requiring miniaturization and high performance.

Key Product Characteristics
HDI PCB micro-via technology and compact design features
  • Compact Design: Micro-vias and buried vias reduce board space, converting 8-layer through-hole designs to 4-layer HDI with equivalent functionality
  • Excellent Signal Integrity: Small vias minimize stray capacitance/inductance with shorter signal paths for faster transmission
  • High Reliability: Enhanced durability and performance in extreme environmental conditions
  • Cost Effective: Reduced manufacturing costs for boards exceeding 8 layers while maintaining full functionality
  • High Wiring Density: Finer lines, smaller holes, and increased density for complex circuit designs
Custom Design Capabilities
Custom PCB design and manufacturing process

We provide fully customizable PCB solutions with flexible layer structures, material selection, and form factors to match specific project requirements. Sample production completed within 7 working days, with mass production and delivery within 15 working days.

Manufacturing Solutions & Technical Expertise
HDI PCB manufacturing challenges and solutions
Precision Micro-Via Drilling

Advanced laser drilling technology creates micro-vias under 150 microns diameter with precise alignment for reliable electrical connections.

Industry Applications
HDI PCB applications across multiple industries
  • Telecommunications: Smartphones, network servers, communication infrastructure
  • Automotive: Electric and autonomous vehicle control systems
  • Healthcare: Wearable monitors, imaging equipment, patient diagnostics
  • Consumer Electronics: High-performance laptops, smartwatches, compact devices
  • Aerospace & Military: High-density packaging with reliable signal transmission
Core Manufacturing Advantages
Ring PCB manufacturing facility and quality control systems
Advanced Engineering Capabilities
  • 2-48 layer boards with blind/buried vias
  • 3/3mil trace/spacing with ±7% impedance control
  • LDI laser exposure, vacuum lamination, flying probe testing
  • IPC-6012 Class 3 standards compliance
Integrated PCBA Services
  • Complete turnkey solutions: PCB fabrication + component sourcing + SMT assembly
  • DFM/DFA optimization to reduce design risks and BOM costs
  • X-ray inspection, AOI testing, 100% functional validation
Quality Assurance & Certifications
  • Self-owned factory with vertical integration
  • AOI + impedance testing + thermal cycling with defect rate
  • ISO9001, IATF16949, and RoHS compliance
Professional Support & Contact Information
PCB assembly and manufacturing equipment

Important: All products require custom service consultation. Contact our customer service before ordering to confirm product details. All photos are authentic with potential minor color variations due to lighting and display differences.

With 17 years of manufacturing excellence, Ring PCB Technology provides comprehensive PCB and PCBA customization services. For professional solutions, contact us at info@ringpcb.com for one-on-one support from our technical sales team.

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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Ring PCB Technology Co.,Limited
Location Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person Michelle Law

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