HDI PCB Boards 2-48 Layers with 3/3mil Trace/Spacing and ±7% Impedance Control for High-Density Interconnect Applications
Price:
negotiable
MOQ:
1unit
Delivery Time:
7-14 working days
Brand:
Ring or support OEM
Product Description
HDI PCB Technology Overview
High-Density Interconnect (HDI) PCBs feature advanced micro-via technology, blind/buried vias, and laser-drilled interconnections that enable higher wiring density per unit area compared to conventional circuit boards.
Key Technical Advantages
Compact Design
Micro-vias and advanced via structures reduce board space by up to 50%, enabling 8-layer functionality in 4-layer configurations.
Signal Integrity
Small vias minimize stray capacitance and inductance, while blind vias and via-in-pad shorten signal paths for faster transmission and superior signal quality.
High Reliability
Enhanced routing and connection technology provides superior durability and performance in extreme environmental conditions.
Manufacturing Specifications
| Parameter | Specification |
|---|---|
| Board Layers | 2-48 layers |
| Trace/Spacing | 3/3 mil |
| Impedance Control | ±7% tolerance |
| Micro-via Diameter | <150 microns |
Custom Manufacturing Solutions
We provide fully customizable PCB solutions with flexible layer structures, material selection, and form factors to match your specific product requirements.
Production Timeline: Sample production within 7 working days, mass production and delivery within 15 working days.
Technical Manufacturing Capabilities
- Advanced laser drilling technology for precision micro-vias
- Automated optical alignment systems for layer stacking
- Impedance control and EMI mitigation techniques
- Uniform copper plating for micro-via reliability
- Thermal management with high-conductivity materials
- Comprehensive quality control with AOI, X-ray, and electrical testing
Industry Applications
- Telecommunications: Smartphones, network servers, 5G infrastructure
- Automotive: Electric vehicles, autonomous systems, navigation controls
- Healthcare: Wearable monitors, imaging equipment, diagnostic devices
- Consumer Electronics: High-performance laptops, tablets, smartwatches
- Aerospace & Military: High-reliability systems requiring compact packaging
Quality Assurance & Certifications
Our self-owned manufacturing facility maintains ISO9001, IATF16949, and RoHS compliance with defect rates below 0.2%.
Integrated PCBA Services
Complete turnkey solutions including PCB fabrication, component sourcing, SMT assembly, and functional testing.
Professional Consultation Required: All products are custom manufactured. Please contact our customer service team before ordering to confirm product specifications and requirements.
Contact: info@ringpcb.com | 17 Years Manufacturing Experience | Self-Owned Factory
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Ring PCB Technology Co.,Limited
Location
Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person
Michelle Law