Ring PCB Technology Co.,Limited
                                                                                                           
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18 Years
Since 2008
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Custom Optical Fiber Communication PCB Assembly - 2-48 Layer Boards with 3/3mil Trace/Spacing and ±7% Impedance Control

Price Negotiable
Price: negotiable
MOQ: 1unit
Delivery Time: 10-15 working days
Brand: Ring PCBA ,support OEM
Product Description
Custom Optical Fiber Communication PCB Assembly Services

Professional turnkey PCB manufacturing and SMT assembly solutions for optical fiber communication equipment, routers, base stations, and IoT devices.

Custom optical fiber communication PCB assembly
Communication PCB Assembly Overview

Communication PCBA (Printed Circuit Board Assembly) serves as the core component in communication devices, integrating microcontrollers, RF chips, and connectors through conductive traces to enable signal processing, transmission, and reception functions.

High-frequency communication PCB assembly
Key Characteristics
  • High-Frequency Performance: Engineered for minimal signal loss and interference in RF bands
  • Miniaturization: High-density component layout with advanced manufacturing techniques
  • Reliability: High-quality materials and strict manufacturing standards for continuous operation
  • Integration: Combines data processing, modulation, demodulation, and communication protocols
  • Customizability: Tailored solutions for specific frequency bands, data rates, and power requirements
Applications

Our communication PCBAs are used in mobile network base stations, routers and modems, satellite communication systems, optical networking equipment, and IoT devices.

Communication PCB assembly applications
Technical Specifications
ParameterSpecification
Board Thickness0.8 - 2.4mm
Line Width/Spacing0.1 - 0.3mm / 0.1 - 0.3mm
Surface FinishENIG, HASL, and other options
Operating Temperature-40°C to 85°C
Signal FrequencykHz to GHz range
Component DensityHigh density with dozens to hundreds of components per square inch
Assembly Accuracy±0.05 - 0.1mm tolerance
Manufacturing Solutions
Signal Integrity Management

Controlled impedance PCB designs with low-loss materials (Rogers, Isola, Nelco) and TDR testing for high-frequency performance.

Thermal Management

Copper heat sinks, thermal vias, and aluminum-backed PCBs with 8-stage lead-free reflow soldering.

HDI Technology

Microvias, blind/buried vias, and fine-pitch technology for multi-layer boards up to 48 layers.

Advanced PCB manufacturing technology
Why Choose Ring PCB
17 Years of Manufacturing Excellence

Self-owned factory with end-to-end technical support and advanced engineering capabilities.

Advanced PCB Manufacturing

2-48 layer boards with 3/3mil trace/spacing, ±7% impedance control, and IPC-6012 Class 3 standards compliance.

Integrated PCBA Services

Complete turnkey solutions including PCB fabrication, component sourcing, SMT assembly, and functional testing.

Professional PCB manufacturing facility
Custom Service Notice

All products are custom manufactured. Please contact our customer service team before ordering to confirm product specifications. Email: info@ringpcb.com

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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Ring PCB Technology Co.,Limited
Location Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person Michelle Law

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