Ring PCB Technology Co.,Limited
                                                                                                           
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18 Years
Since 2008
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RoHS Communication PCB Board with HASL Surface Finish - 0.8-2.4mm Thickness for High-Frequency Applications

Price Negotiable
Price: negotiable
MOQ: 1unit
Delivery Time: 10-15 working days
Brand: Ring PCBA ,support OEM
Product Description
Communication PCB Assembly Overview

Communication PCBA (Printed Circuit Board Assembly) refers to printed circuit boards populated with electronic components specifically designed for communication applications. These assemblies serve as core components in routers, wireless access points, mobile phones, base stations, and other communication devices.

Key Characteristics
  • High-Frequency Performance: Engineered to handle radio-frequency signals with minimal loss and interference
  • Miniaturization: High-density component layouts using advanced manufacturing techniques
  • Reliability: High-quality materials and strict manufacturing standards for continuous operation
  • Integration: Combines data processing, modulation, demodulation, and communication protocols
  • Customizability: Adjustable communication frequency bands, data transfer rates, and power consumption
Communication PCBA board with high-density component layout
Technical Specifications
ParameterSpecification
Board Thickness0.8 - 2.4mm
Line Width/Spacing0.1 - 0.3mm / 0.1 - 0.3mm
Surface FinishENIG, HASL, and other options
Operating Temperature-40°C to 85°C
Signal FrequencykHz to GHz range depending on application
Component DensityHigh density with dozens to hundreds of components per square inch
Assembly Accuracy±0.05 - 0.1mm component placement tolerance
Manufacturing Solutions
Signal Integrity

Controlled impedance PCB designs with low-loss materials (Rogers, Isola, Nelco) and TDR testing ensure optimal high-frequency performance.

Thermal Management

Copper heat sinks, thermal vias, and aluminum-backed PCBs with 8-stage lead-free reflow soldering.

HDI Technology

Microvias, blind/buried vias, and fine-pitch technology for compact, high-density designs up to 48 layers.

High-density interconnect PCB with microvia technology
Quality & Compliance

17 Years Manufacturing Experience - Serving over 20,000 customers worldwide

Full Certifications - ISO9001, IATF16949, RoHS compliance

End-to-End Services - PCB fabrication, component sourcing, SMT assembly, functional testing

Quality Assurance - AOI, X-ray inspection, impedance testing with defect rate

PCB assembly quality control and testing process
Custom Order Information

All products are custom services. Please contact our customer service team before ordering to confirm product details.

Contact: info@ringpcb.com | Professional one-on-one technical support available

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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Ring PCB Technology Co.,Limited
Location Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person Michelle Law

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