0.8mm-2.4mm Communication PCB Turnkey Assembly Service | 48-Layer HDI Boards with ±7% Impedance Control
Price:
negotiable
MOQ:
1unit
Delivery Time:
10-15 working days
Brand:
Ring PCBA ,support OEM
Product Description
Communication PCB Assembly Services
Ring PCB provides professional turnkey PCB assembly services for communication devices, specializing in boards ranging from 0.8mm to 2.4mm thickness. With 17 years of manufacturing expertise, we serve global clients with comprehensive solutions from design to delivery.
Communication PCBA Overview
Communication PCBA (Printed Circuit Board Assembly) serves as the core component in various communication devices including routers, wireless access points, mobile phones, and base stations. These assemblies integrate microcontrollers, radio-frequency chips, and connectors through complex conductive traces to enable signal processing, transmission, and reception functions.
Key Characteristics
- High-Frequency Performance: Engineered for minimal signal loss and interference in radio-frequency bands
- Miniaturization: High-density component layouts with advanced manufacturing techniques
- Reliability: High-quality materials and strict manufacturing standards for continuous operation
- Integration: Combines data processing, modulation, demodulation, and communication protocols
- Customizability: Tailored solutions for specific frequency bands, data rates, and power requirements
Technical Specifications
| Parameter | Specification |
|---|---|
| Board Thickness | 0.8 - 2.4mm |
| Line Width/Spacing | 0.1 - 0.3mm / 0.1 - 0.3mm |
| Surface Finish | ENIG, HASL, and other options |
| Operating Temperature | -40°C to 85°C |
| Signal Frequency | kHz to GHz range depending on application |
| Component Density | High density with dozens to hundreds of components per square inch |
| Assembly Accuracy | ±0.05 - 0.1mm tolerance |
Manufacturing Solutions
Signal Integrity Management
Controlled impedance PCB designs with low-loss materials (Rogers, Isola, Nelco) and TDR testing ensure optimal performance in high-frequency communication systems.
Thermal Management
8-stage lead-free reflow soldering process with copper heat sinks, thermal vias, and aluminum-backed PCBs for efficient heat dissipation.
HDI Technology
Microvias, blind/buried vias, and fine-pitch technology support multi-layer PCBs up to 48 layers for compact, high-performance systems.
Quality & Certifications
Our manufacturing processes comply with ISO9001, IATF16949, RoHS, and REACH standards. Rigorous testing includes AOI, X-ray inspection, impedance testing, and thermal cycling with defect rates below 0.2%.
Turnkey Service Advantages
End-to-End Solutions
- PCB fabrication + component sourcing + SMT assembly + functional testing
- DFM/DFA optimization to reduce design risks and BOM costs
- Self-owned factory with full supply chain control and vertical integration
- 17 years of manufacturing excellence serving over 20,000 customers worldwide
Custom Service Information
All products are custom services. Please contact our customer service before ordering to confirm product details. For professional solutions, email info@ringpcb.com for one-on-one service from our sales team.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Ring PCB Technology Co.,Limited
Location
Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person
Michelle Law