Ring PCB Technology Co.,Limited
                                                                                                           
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18 Years
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ENIG Surface Finish Communication PCBA for Base Station Mobile Networks - 0.8-2.4mm Thickness, -40°C to 85°C Operating Range

Price Negotiable
Price: negotiable
MOQ: 1unit
Delivery Time: 10-15 working days
Brand: Ring PCBA ,support OEM
Product Description
Communication PCBA for Base Station Mobile Networks

Professional ENIG surface finish PCB assemblies designed specifically for high-frequency communication applications in base stations, routers, and mobile networks.

Communication PCBA board with ENIG surface finish for base station applications
Product Overview

Communication PCBA (Printed Circuit Board Assembly) serves as the core component in various communication devices, integrating microcontrollers, radio-frequency chips, and connectors through conductive traces to enable signal processing, transmission, and reception functions.

Key Characteristics
  • High-Frequency Performance: Engineered to handle high-frequency signals with minimal loss and interference
  • Miniaturization: High-density component layout with advanced manufacturing techniques
  • Reliability: High-quality materials and strict manufacturing standards for continuous operation
  • Integration: Combines data processing, modulation, demodulation, and communication protocols
  • Customizability: Adjustable communication frequency band, data transfer rate, and power consumption
Technical Specifications
ParameterSpecification
Board Thickness0.8 - 2.4mm
Line Width/Spacing0.1 - 0.3mm / 0.1 - 0.3mm
Surface FinishENIG (Electroless Nickel Immersion Gold)
Operating Temperature-40°C to 85°C
Signal FrequencykHz to GHz range depending on application
Component DensityHigh density with dozens to hundreds of components per square inch
Assembly Accuracy±0.05 - 0.1mm tolerance
Manufacturing Solutions
Signal Integrity

Controlled impedance PCB designs with low-loss materials (Rogers, Isola, Nelco) and TDR testing for optimal performance.

Thermal Management

Copper heat sinks, thermal vias, and aluminum-backed PCBs with 8-stage lead-free reflow soldering.

HDI Technology

Microvias, blind/buried vias, and fine-pitch technology for multi-layer PCBs up to 48 layers.

Why Choose Ring PCB
17 Years of Excellence

Served over 20,000 domestic and international customers with professional PCB and PCBA solutions.

  • Self-owned factory with full supply chain control
  • End-to-end technical support and DFM/DFA optimization
  • ISO9001, IATF16949, and RoHS certified manufacturing
  • Advanced quality control: AOI, X-ray, impedance testing, thermal cycling
Custom Service Notice

All products are custom manufactured. Please contact our professional customer service at info@ringpcb.com to confirm product details and receive one-on-one technical support.

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Ring PCB Technology Co.,Limited
Location Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person Michelle Law

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