Ring PCB Technology Co.,Limited
                                                                                                           
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18 Years
Since 2008
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4 Layers PTFE And FR4 Multilayer PCB Manufacturing For Industrial Medical And RF Applications

Price Negotiable
Price: $2.99-$2999.99 per unit, depends on the complexity of the PCB board
MOQ: 1unit
Delivery Time: 10-15 working days
Brand: Ring PCB,support OEM& EMS
Product Description

Multilayer PCB Manufacturing and One-Stop PCB & PCBA Services

What Is Multilayer PCB Manufacturing?

Multilayer PCB manufacturing refers to the fabrication of printed circuit boards that contain multiple conductive copper layers laminated together with insulating materials. These boards are widely used in industrial electronics, medical devices, RF communication systems, automotive electronics, and other advanced applications that require high reliability and stable electrical performance.

At Ring PCB, we focus on professional multilayer PCB manufacturing and PCB assembly services based on customer-provided Gerber files, drawings, and technical requirements. While PCB design is supplied by the customer, our experienced engineering and production teams ensure accurate manufacturing, strict quality control, and consistent product performance.


Product Features and Advantages

Mixed-Material Multilayer PCB Structure

This multilayer PCB adopts a PTFE + FR4 hybrid material structure, which is commonly used in high-frequency, industrial, and medical electronics.

  • PTFE layers support low-loss signal transmission

  • FR4 layers provide mechanical strength and cost efficiency

  • Suitable for demanding environments requiring electrical stability

This structure demonstrates Ring PCB’s capability in advanced multilayer printed circuit board manufacturing.

Here is a photo of a customized Printed Circuit Board we had manufactured for our client.






Common Technical Parameters

Item Specification
PCB Type Multilayer Printed Circuit Board
Layer Count 4 Layers
Base Materials PTFE + FR4 (Mixed Material)
Board Thickness 1.6 mm
Surface Finish Immersion Gold (ENIG)
Special Process Mixed Material Lamination, Edge Plating
Typical Applications Industrial, Medical, RF, High-Frequency Electronics

Note:
The above parameters are for reference only. Actual specifications and technical requirements may vary depending on application and customer documentation.
For detailed parameters and manufacturing feasibility, please contact our professional customer service team:

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Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Ring PCB Technology Co.,Limited
Location Building 36A,Longwangmiao Industrial park, Baishixia Community, Fuyong Street, Bao'an District, Shenzhen,China
Contact Person Michelle Law

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