Custom FR4 4-Layer HDI Power Bank PCB Board with 0.2-3.2mm Thickness and 0.3mm BGA Pitch
Price:
5
MOQ:
1
Delivery Time:
3-5days
Brand:
Hansion
Product Description
Custom FR4 4-Layer HDI Power Bank PCB Board
Key Specifications
| Parameter | Specification |
|---|---|
| Board Thickness | 0.2-3.2mm |
| Copper Thickness | 1/3-8 oz |
| Min. Drill Hole Size | 0.1mm |
| BGA Pitch | 0.3mm |
| Impedance Control | ±8% |
| Max. Board Size | 540×620mm |
Product Overview
HDI (High Density Interconnect) PCB boards represent advanced printed circuit technology designed for modern electronic applications. These 4-layer FR4 boards with gold finishing are engineered for power bank applications requiring high reliability and compact design.
Technical Features
- HDI technology for superior circuit density
- Board thickness range: 0.2-3.2mm
- 1:1 blind hole aspect ratio capability
- Precise impedance control at ±8%
- 0.3mm BGA pitch for high-density component mounting
- Layer misalignment control: ±0.06mm
- Maximum warpage: ≤0.4%
- Minimum core thickness: 0.05mm
Performance Advantages
Space Optimization
Smaller, lighter boards ideal for portable power bank applications
Smaller, lighter boards ideal for portable power bank applications
Enhanced Performance
Superior signal integrity and circuit density
Superior signal integrity and circuit density
Cost Efficiency
Reduced layer count lowers production costs
Reduced layer count lowers production costs
Reliability
Advanced manufacturing ensures durability and long service life
Advanced manufacturing ensures durability and long service life
Applications
These HDI PCB boards are specifically designed for consumer electronics applications including:
- Power banks and portable chargers
- Smartphones and tablets
- Wearable devices
- Medical equipment
- Automotive electronics
- Telecommunications devices
Customization Options
We offer comprehensive customization services for your specific requirements:
- Custom PCB design and layout
- Specialized drilling sizes and aspect ratios
- Alternative materials and surface finishes
- BGA pitch customization
- Precision layer alignment control
Ordering Information
| Parameter | Details |
|---|---|
| Minimum Order Quantity | 1 piece |
| Delivery Time | 2-7 days |
| Packaging | Vacuum packing |
| Supply Capacity | 500,000 SQM per month |
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hansion Technology Co., Ltd.
Location
Address: 8th floor，Jinlong Bldg., Xiaobian, Chang'an Town, Dongguan，China
Contact Person
Hank xiong