Open Top Programming IC Test Socket High Temperature 130°C for BGA QFN CSP Packages with 30K-50K Insertion Cycles

Price Negotiable

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MOQ: 1

Delivery Time: Negotiable

Brand: Sireda

Product Description

Premium Open Top Burn-In & Programming Test Socket

Designed for reliability in high-temperature environments up to 130°C+, our burn-in test sockets ensure consistent performance during extended IC programming and testing cycles.

Key Features

Customizable configurations for specific IC packages (BGA, QFN, CSP)
Robust construction for 30K-50K insertion cycles without wear
Optimized for automated test equipment (ATE) integration
High-temperature operation up to 130°C

Open Top IC Test Socket product image showing construction and design

Technical diagram of Open Top IC Test Socket specifications and components

Technical Specifications

Property	Parameter	Typical Value
Mechanical	Insertion Cycles	≥30K-50K cycles
	Contact Force	20-30g/pin
	Operating Temperature	Commercial: -40°C to +125°C Military: -55°C to +130°C
	Tolerance	±0.01mm
Electrical	Contact Resistance	<50mΩ
	Impedance	50Ω (±5%)
	Current	1.5A-3A

Standard Solutions

Ready for immediate deployment across various applications:

Fine-Pitch BGA Sockets (0.3mm-1.5mm pitch options)
Low-Profile QFN/LGA Sockets with zero-insertion-force (ZIF) actuation
High-Speed/RF Sockets (DC to 70GHz with minimal signal loss)
Mission-Critical Sockets for burn-in, automotive, and MIL-STD environments

Your Trusted Partner for Precision IC Test Solutions

Sireda delivers end-to-end test socket solutions from high-volume standard models to fully bespoke configurations engineered for your exact requirements.

Ideal for semiconductor manufacturers, testing labs, and R&D facilities requiring precision and longevity in IC programming and testing applications.