Zero Footprint eMMC Test Socket BGA162/BGA169/BGA254 - 10,000+ Cycles -40°C to +125°C
Price:
Get Quote
MOQ:
1
Delivery Time:
Negotiable
Brand:
Sireda
Product Description
High-Performance Zero-Footprint eMMC Test Sockets
Our innovative direct-solder test sockets revolutionize eMMC memory validation with ultra-compact, chip-size interposer design. Eliminating the need for PCB modifications, these sockets save valuable development time while ensuring superior signal integrity.
Key Features & Benefits
- Perfect chip-sized interposer matches exact BGA153/BGA100/BGA162/BGA169/BGA254 footprints
- No PCB cutouts required - simpler board layout design
- Direct solder mounting for instant testing capability
Flexible Testing Options
Standard F Series: Simple, reliable contact solution
Advanced F1 Series:
- Integrated test points for signal monitoring
- Power consumption analysis capabilities
- Debugging-friendly architecture
Engineering-Grade Reliability
- 10,000+ insertion cycles - exceeds industry standards
- -40°C to +125°C operating temperature range
- Gold-plated contacts for superior conductivity
Compatible Package Types
| UFS | eMCP | eMMC | DDR | LPDDR | NAND |
|---|---|---|---|---|---|
| BGA254 | BGA221 | BGA153 | BGA78 | BGA200 | BGA132 |
| BGA153 | BGA162 | BGA96 | BGA315 | BGA136 | |
| BGA169 | BGA152 | ||||
| BGA100 | BGA154 | ||||
| BGA254 |
The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details.
F vs F1 Solution Comparison
Installation Steps
- Solder interposer to test board
- Attach test socket
- Insert chip and lock cover
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Sireda Technology Co., Ltd.
Location
Floor 6, Building 4, 10th Industry Park, GM Tianliao, Guangming New District, Shenzhen, PRC
Contact Person
Wang