BGA221 eMCP Test Socket - Zero Footprint Design with 0.5mm Pitch and 10,000+ Cycles
Price:
Get Quote
MOQ:
1
Delivery Time:
Negotiable
Brand:
Sireda
Product Description
Revolutionize your embedded memory validation with our zero-footprint BGA221 eMCP test socket. The precision-engineered interposer matches the exact chip footprint, enabling direct solder mounting without PCB modifications.
Key Advantages
- Instant deployment with no PCB milling requirements
- Two configurations available: F-Series (standard contact solution) and F1-Series (integrated test points for signal analysis)
- Supports LPDDR+NAND stacked packages
- Gold-plated contacts ensure > 10,000 test cycles
- Compact 2.5mm profile ideal for dense boards
Technical Specifications
- BGA221 compatibility with 0.5mm pitch
- Supports JEDEC eMCP standards
- Operating temperature: -40°C to +125°C
- Signal integrity up to 4266Mbps
Ideal Applications
Memory manufacturers, smartphone repair centers, embedded system developers
The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details.
Package Compatibility
| UFS | eMCP | eMMC | DDR | LPDDR | NAND |
|---|---|---|---|---|---|
| BGA254 | BGA221 | BGA153 | BGA78 | BGA200 | BGA132 |
| BGA153 | BGA162 | BGA96 | BGA315 | BGA136 | |
| BGA169 | BGA152 | ||||
| BGA100 | BGA154 | ||||
| BGA254 |
F vs F1 Solution Comparison
Installation Steps
- Solder interposer to test board
- Attach test socket
- Insert chip and lock cover
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Sireda Technology Co., Ltd.
Location
Floor 6, Building 4, 10th Industry Park, GM Tianliao, Guangming New District, Shenzhen, PRC
Contact Person
Wang