Zero Footprint Memory Test Socket for DDR3/DDR4/DDR5 with BGA254 Compatibility and Space-Saving Interposer Design
Price:
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MOQ:
1
Delivery Time:
Negotiable
Brand:
Sireda
Product Description
Universal Memory Testing Solution
Our zero footprint memory test socket for DDR3/DDR4/DDR5 features an interposer-based design that matches the chip's size, allowing direct mounting onto test PCBs without requiring cutouts. This enables fast and reliable IC testing without redesigning the PCB.
Key Features
- No PCB Cutout Needed - Interposer matches chip size, solders directly to the board
- Two Versions Available:
- F Model - No signal breakout, for basic continuity and functional testing
- F1 Model - Includes signal breakout points, enabling power consumption and signal integrity analysis
- Space-Saving & Fast Testing - Simplifies PCB layout while ensuring efficient memory IC testing
- Compatible with DDR3, DDR4 & DDR5 - Ensures future-proof testing solutions
Perfect for prototyping, hardware validation, and production testing, our zero-footprint sockets ensure faster time-to-market with minimal PCB modifications.
The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details.
Compatible BGA Packages
| UFS | eMCP | eMMC | DDR | LPDDR | NAND |
|---|---|---|---|---|---|
| BGA254 | BGA221 | BGA153 | BGA78 | BGA200 | BGA132 |
| BGA153 | BGA162 | BGA96 | BGA315 | BGA136 | |
| BGA169 | BGA152 | ||||
| BGA100 | BGA154 | ||||
| BGA254 |
F vs F1 Solution Comparison
Installation Steps
- Solder interposer to test board
- Attach test socket
- Insert chip and lock cover
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Sireda Technology Co., Ltd.
Location
Floor 6, Building 4, 10th Industry Park, GM Tianliao, Guangming New District, Shenzhen, PRC
Contact Person
Wang