Huona (Shanghai) New Material Co., Ltd.
                                                                                                           
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18 Years
Since 2008
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Hermetic Sealing Metal Package Header with Kovar Alloy and Customizable Pin Configuration

Price Negotiable
Price: 30
MOQ: 100PCS
Delivery Time: 15DAYS
Brand: HUONA
Product Description

Product Overview

Metal package headers are widely used in semiconductor devices, electronic components, sensors, and optoelectronic modules that require reliable hermetic sealing. These headers provide a stable platform for mounting electronic chips while protecting internal components from moisture, dust, and environmental contamination.

The metal body is commonly manufactured from Kovar alloy, stainless steel, or copper alloys, offering excellent mechanical strength, thermal stability, and compatibility with glass sealing materials. Metal headers provide high insulation resistance, strong structural integrity, and excellent reliability for demanding electronic applications.

They are widely used in semiconductor packaging, optical communication modules, industrial sensors, aerospace electronics, and medical equipment.


Technical Parameters

Item Specification
Product Type Metal Package Header
Package Structure Hermetic Metal Package
Base Material Kovar Alloy / Stainless Steel / Copper Alloy
Glass Material Borosilicate Glass
Lead Material Kovar Alloy
Lead Finish Gold Plated / Nickel Plated / Tin Plated
Number of Pins 2–10 Pins Customizable
Sealing Type Glass-to-Metal Hermetic Seal
Leak Rate ≤1×10⁻⁹ Pa·m³/s
Insulation Resistance ≥10⁹ Ω at 100 V DC
Operating Temperature -55°C to +200°C
RoHS Compliance Yes

Custom Attributes

Attribute Value
Product Name Metal Package Header
Alternate Name Metal Can Package / Hermetic Metal Package
Package Type Hermetic Metal Package
Base Material Kovar Alloy / Stainless Steel
Glass Type Borosilicate Glass
Lead Material Kovar Pins
Lead Plating Gold Plated / Nickel Plated / Tin Plated
Pin Configuration Customizable
Sealing Technology Glass-to-Metal Sealing
Leak Rate ≤1×10⁻⁹ Pa·m³/s
Insulation Resistance ≥10⁹ Ω
Surface Treatment Nickel Plating / Gold Plating
Manufacturing Process Precision Stamping and Glass Sealing
Quality Control Hermetic Test / Electrical Test / Visual Inspection
Certification RoHS Compliant
Customization Available According to Drawings

Product Features

Feature Description
Hermetic Sealing Reliable airtight sealing for electronic devices
High Mechanical Strength Durable metal structure for long-term use
Excellent Thermal Stability Stable performance under temperature changes
High Electrical Insulation Prevents electrical leakage and interference
Flexible Customization Various pin configurations and plating options

Typical Applications

Application Area Example Use Case
Semiconductor Devices Transistors and integrated circuits
Optoelectronic Devices Laser diodes and photodiodes
Sensor Modules Infrared sensors and pressure sensors
Optical Communication Optical transmitters and receivers
Aerospace Electronics High reliability electronic modules
Medical Equipment Precision electronic detection systems

Packaging and Delivery

Item Details
Packaging Vacuum sealed trays packed in export cartons
Lead Time 7–15 working days depending on order quantity
Shipping Air freight, sea freight, or international express
Traceability Each tray labeled with lot number and product code
Minimum Order Quantity Negotiable depending on customization

Customization Capability

Our experienced R&D team can design and manufacture metal package headers according to customer drawings and technical requirements. Custom dimensions, pin configurations, plating types, and packaging solutions are

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Huona (Shanghai) New Material Co., Ltd.
Location 1900 Mudanjiang Road, Baoshan District, 201999, Shanghai, China
Contact Person Roy

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