Semiconductor Wafer Cleaning Machine 120KW with 40KHZ/80KHZ Ultrasound and Three-Tank Gradient System
Price:
￥800000
MOQ:
1
Delivery Time:
30-60work days
Brand:
Jietai
Product Description
Semiconductor Wafer Cleaning System Overview
Advanced three-tank gradient cleaning system featuring ultrasonic alkaline cleaning, ultrasonic acidic cleaning, and pure water rinsing for comprehensive semiconductor wafer processing.
Core Technical Advantages
Ultrasonic Alkaline Cleaning Tank (pH 10-13)
| Parameter | Specification |
|---|---|
| Frequency | 80kHz/120kHz dual-frequency switching with pulsed ultrasound |
| Tank Material | Modified PTFE liner with 316L stainless steel frame (130°C high temperature resistance, NaOH/ammonia corrosion resistance) |
| Cleaning Medium | Alkaline solutions including potassium hydroxide (KOH), tetramethylammonium hydroxide (TMAH) |
- Efficient photoresist residue stripping: Destroys adhesive film molecular bonds through cavitation effect with 50-80°C constant temperature control
- Removes 99.9% of SU-8/positive photoresist within 15 minutes
- Particle contaminant capture: Built-in 5μm PP cartridge + magnetic filter for Fe/Co metal particles
- Real-time filtration of cleaning waste
Ultrasonic Acid Cleaning Tank (pH 1-3)
| Parameter | Specification |
|---|---|
| Frequency | 150kHz high-frequency ultrasonication for minimal wafer surface damage |
| Tank Material | Perfluoroalkoxy Resin (PFA) liner resistant to HF/HNO₃ mixed acid |
| Cleaning Medium | BOE buffer oxide etchant (HF:NH₄F=1:6), aqua regia (HNO₃:HCl=1:3) |
- Deep metal ion removal capability
- Surface roughness control: Ultrasonic power dynamically adjusted (50-300W) with ±0.5°C temperature precision
- Maintains wafer surface Ra value ≤ 0.2nm
- Reduces Na⁺/K⁺ residue to
Pure Water Megasonic Rinsing Tank (Resistivity ≥ 18.2MΩ・cm)
| Parameter | Specification |
|---|---|
| Frequency | 850kHz MF ultrasound with cavitation threshold > 200μm |
| Water Quality Monitoring | Online TOC detector (≤ 5ppb accuracy) + particle counter (0.1μm detection) |
| Rinsing Method | Countercurrent rinsing (85% pure water utilization) + megasonic cavitation |
- Residue-free cleanliness: DI water three-stage filtration (activated carbon + RO membrane + polishing resin)
- 50L/min overflow rate achieves TOC residual
- Edge-enhanced cleaning: Patented rotating spray arm (0-300rpm adjustable) eliminates 1mm edge cleaning blind spots
Request Technical Documentation
Contact us today for the Semiconductor Wafer Cleaning Process White Paper and exclusive quote program!
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Company
guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.
Location
2nd Floor, Unit 2, Building 16, No. 7, Science and Technology Avenue, Houjie Town, Dongguan City, Guangdong Province
Contact Person
Leonard