Semiconductor Silicon Wafer Cleaner with 40KHz-80KHz Ultrasonic Technology and 60℃ Temperature Control for 4-12 Inch Wafers

This precision-engineered semiconductor wafer cleaning system delivers sub-micron level surface purity essential for advanced node fabrication down to 5nm. The integrated multi-stage process ensures optimal contamination removal while maintaining wafer integrity.

• Ultrasonic Alkaline Scrubbing: 40KHz-80KHz ultrasonic cavitation in alkaline bath removes organic contaminants, photoresist residuals, and macro-particles ≥1μm from wafer surfaces and via structures
• Ultrasonic Acid Etching: Frequency-tunable acidic media dissolves inorganic impurities including metal ions (Fe, Cu, Zn) and native oxide layers (SiO₂)
• Ultra-Pure Water Rinsing: Final UPW rinse achieves surface resistivity ≥18.2MΩ*cm, meeting SEMI F20 standards for pre-deposition cleaning

• Compatible with FOUP/SMIF pod loading for automated cassette handling
• Recipe storage for 50+ cleaning protocols
• Adaptable to bare wafers, SOI wafers, and epi-wafers
• Validated particle counter readings ≤10 particles/wafer for ≥0.1μm

Essential for pre-lithography, post-CMP, and post-etch cleaning processes in logic, memory, and MEMS fabrication lines.