Global Soul Limited
                                                                                                           
Verified Supplier
15 Years
Since 2011
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KY8030-2 3D Solder Paste Inspection Machine 22KW 220Vac with Real-Time Process Monitoring

Price Negotiable
Price: USD+negotiable+pcs
MOQ: 1 PCS
Delivery Time: 1-7 days
Brand: KOH YOUNG
Product Description
KY8030-2 3D Solder Paste Inspection Machine
Advanced 22KW capacity 220Vac 3D solder paste inspection system with real-time process monitoring and optimization capabilities for precision electronics manufacturing.
Closed Loop Real-Time Screen Printer Communication
KY8030-2 3D SPI machine real-time screen printer communication interface
  • Real-time communication of printing process monitoring data with screen printers
  • Result reporting after optimization by Koh Young's SPC software
KY8030-2 3D SPI machine pick-and-place process monitoring
  • Real-time communication of pick-and-place process monitoring data with mounters
  • Supports process optimization by controlling panels containing defects
SPC Plus Printing Process Optimization Tool
  • Review, diagnosis and optimization of printing, pick-and-place and reflow processes
  • 3D data based SPI-AOI communication solution
  • Traces root cause of defects by storing and communicating inspection results from Koh Young's 3D SPI and 3D AOI Systems
KY8030-2 3D SPI machine SPC Plus optimization interface
KSMART Link Communication Solution
  • Provides intuitive statistical process analysis data using reliable 3D measurement data
  • Communicates with a wide range of production management systems
KY8030-2 3D SPI machine KSMART Link communication dashboard
Technical Specifications
Model KY8030-2
Power Capacity 22KW
Voltage 220Vac
Inspection Type 3D Solder Paste Inspection
Communication Closed Loop Real-Time with Screen Printers & Mounters
Software Integration SPC Plus, KSMART Link

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Global Soul Limited
Location Room 205, 2/F, Bldg B, Tengjun Tech Park, Buxin K Rd, Area 73, Buxin, Xin'an, Bao'an, Shenzhen
Contact Person Yi Lee

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