PARMI HS60XXL Solder Paste Inspector with 3D Laser Triangulation Sensor, Real-Time Warpage Tracking, and 65mm Component Inspection
Price:
USD+negotiable+pcs
MOQ:
1 PCS
Delivery Time:
1-7 days
Brand:
PARMI
Product Description
PARMI SPI HS60XXL SOLDER PASTE INSPECTOR
Advanced Inspection Technology
- 3D Laser Triangulation Sensor Provides robust 3D data and profiles the real shape of features, offering high accuracy against variations in materials and surface conditions.
- Dual Laser Projection Eliminates shadow effects, allowing for precise measurement of components, even those with significant height differences.
Real-Time Warpage Tracking
Accurately measures PCB warpage up to ±5mm using real-time Z-axis control and scanning.
Component Inspection Capabilities
Can inspect components up to 65mm in height using a multi-step scanning method, providing industry-leading height measurement capabilities.
User Interface and Control
- Features a user-friendly interface with graphical windows for easy operation and setup.
- Supports remote management of multiple SPI systems, reducing manpower needs while maintaining consistent quality.
Inspection Performance
Models like the HS60 Supreme offer inspection speeds of 100cm²/sec at resolutions of 13x13μm.
Note: Specific speeds for the HS60XXL model are not detailed in the provided specifications.
Material Compatibility
PARMI's inspection technology is compatible with various materials and surface conditions, unaffected by color or material variations.
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Company
Global Soul Limited
Location
Room 205, 2/F, Bldg B, Tengjun Tech Park, Buxin K Rd, Area 73, Buxin, Xin'an, Bao'an, Shenzhen
Contact Person
Yi Lee