12-Layer SMT PCB Board 2.0mm Thickness with TG170 Material and 3/3mil Line Spacing
Price:
USD+negotiable+pcs
MOQ:
1 PCS
Delivery Time:
5-15 days
Brand:
GS
Product Description
High-Performance 12-Layer PCB Manufacturing
Key Specifications
| Parameter | Specification |
|---|---|
| Board Thickness | 2.0mm |
| Material | Sheng Yi TG170 |
| Surface Finish | Gold Plating (ENIG) |
| Line Width/Spacing | 3/3mil |
| Special Features | Impedance Control, Press-Fit Holes |
Advanced Features
- 12-layer stack-up for complex circuit designs
- High-temperature TG170 material for superior thermal performance
- Precision impedance control for signal integrity
- Press-fit hole technology for reliable component mounting
- Fine 3/3mil line spacing for high-density layouts
- ENIG surface finish for excellent solderability and corrosion resistance
Product Images
Related Technologies
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Global Soul Limited
Location
Room 205, 2/F, Bldg B, Tengjun Tech Park, Buxin K Rd, Area 73, Buxin, Xin'an, Bao'an, Shenzhen
Contact Person
Yi Lee