8 Layers 1.6mm Thick FR4 Sheng Yi TG170 Plate Soft and Hard Bonding PCB for High-Performance Applications
Price:
USD+negotiable+pcs
MOQ:
1 PCS
Delivery Time:
5-15 days
Brand:
GS
Product Description
8 Layer Soft and Hard Bonding Board for PCB Manufacturing
Advanced 8-layer rigid-flex PCB combining FR4 and polyimide materials for high-reliability applications in demanding electronic environments.
Product Specifications
Layer Configuration: 8-layer soft and hard bonding
Board Thickness: 1.6mm
Material Composition: FR4 Sheng Yi TG170 plate + soft board PI communication board
Minimum Hole Size: 0.2mm maximum
Key Features
- Combined rigid and flexible circuit design
- High-temperature performance with TG170 material
- Precision drilling capabilities down to 0.2mm
- Enhanced reliability for complex electronic applications
- Ideal for communication and high-frequency applications
PCB Manufacturing Capabilities
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Global Soul Limited
Location
Room 205, 2/F, Bldg B, Tengjun Tech Park, Buxin K Rd, Area 73, Buxin, Xin'an, Bao'an, Shenzhen
Contact Person
Yi Lee