Precision Photo Chemical Etched Lead Frames with 0.05mm Pitch and ±0.01mm Tolerance for Semiconductor Packaging

Xinhaisen Technology specializes in manufacturing precision-etched lead frames for semiconductor and microelectronics packaging. Our lead frames serve as the critical interconnection platform for IC chips, providing superior electrical conductivity, heat dissipation, and mechanical stability.

• Ultra-precise chemical etching technology
• Achieves fine pitch down to 0.05mm with tight tolerance of ±0.01mm
• Produces smooth burr-free edges for perfect die attachment

• Precision beyond conventional stamping methods
• Achieves finer features and tighter tolerances
• No mechanical stress or deformation

• 13+ years of specialized etching experience
• Engineering support from design to final product
• Strict confidentiality protection for all customer designs

Sample orders can be shipped in 3-5 days. Mass production lead time depends on quantity, typically 1-2 weeks. Express shipping is available.

• Accepted Delivery Terms: FOB, CFR, CIF, EXW
• Accepted Payment Currency: USD, EUR, JPY, CAD, AUD, HKD, CNY
• Accepted Payment Type: T/T, Paypal, Western Union, Cash
• Language Spoken: English, Chinese