Precision Pre Sintering Die Bonder Equipment For Automotive Grade SiC Chips

Price Negotiable

Price: Negotiation

MOQ: 1set

Delivery Time: Negotiable

Brand: UW

Product Description

Equipment Overview

This equipment is configured with a dual-drive gantry platform and a customized feeding platform, compatible with expansion rings, feeders, Wafer PAK, and vibratory bowls. It can handle a variety of materials and processes, including silver paste and silver film, and is suitable for automotive-grade SiC chips, DTS, clips, NTCs, resistors, etc.

Highlights

Powerful & Precision Bonding: 30kgf force + 250°C high temperature
Dual-Process Support: Silver paste / Silver film
Fully Automatic Gantry System
Flexible Feeding Configuration

Technical Parameters

Parameter Name	Parameter Values
Cycle Time	4000ms (Dependent on product)
XY Placement Accuracy	±15μm @ 3σ (Standard die accuracy; actual product accuracy depends on incoming materials)
Theta Range	±1° @3σ
Force Control	20g-300g
Die Size	0.15×0.15mm-15×15mm
Die Thickness	≥ 70um
NTC	Tape & Reel, Electronic Feeder
Capacity	1000 pcs/h (Depending on jig matrix density)
Magazine	4inch Gel-PAK,Wafer-PAK (Customizable)
Conveyor Width	200*350mm (Customizable)
PR System	256 Grayscale
Resolution	1920pixel×2560pixel (Customizable)
PR Accuracy	5M(1920×2560pixel) FOV(16mm；×1,×2,×4)
Dimensions (L×W×H)	1600×1250×2000mm (L×W×H)
Weight	2000kg