6OZ 16 Layer Thick Copper Core PCB 94v 0 Circuit Board High Electrical Conductivity
6OZ 16 Layers Thick Copper PCB High Electrical Conductivity
♦ What is Thick copper PCB?
Thick copper PCB refers to a circuit board formed by bonding a layer of copper foil with a thickness of 2 ounces (oz, about 62.5 microns) or more to FR-4 or other substrates during the printed circuit board (PCB) manufacturing process.
♦ Features of Thick Copper PCB
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Excellent conductivity: Thick copper foil greatly improves conductivity, reduces impedance, meets the needs of high-current and high-frequency equipment, and improves circuit speed and reliability.
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Strong load-bearing capacity: Thickening copper foil enhances mechanical strength and rigidity, can withstand higher physical pressure, bending and mechanical/thermal stress, and adapt to harsh environments.
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Good heat dissipation: Thick copper layer quickly disperses heat, reduces thermal stress, ensures stable operation of high-power equipment and extends life.
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High thermal stability: Efficient heat conduction reduces heat accumulation and maintains performance stability of equipment at high temperatures.
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High design flexibility: Supports wider lines and smaller spacing to achieve complex and high-density circuit layout.
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♦ Applications of Thick Copper PCB
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- Automotive electronics: such as battery management systems, electric power steering systems, on-board chargers, motor controllers, etc., adapt to the vibration and stress environment of automobile driving to ensure vehicle performance and safety.
- Power supply systems: such as power modules, DC-DC converters, inverters, rectifiers, etc., reduce energy loss and temperature rise, ensure efficient operation and long life.
- Industrial control: used for high-power motor drives, automation equipment, industrial control systems, etc., to ensure stable operation of the system under harsh conditions, avoid production interruptions and safety accidents.
- New energy: in solar photovoltaic systems, wind power generation systems, energy storage systems, etc., to ensure efficient and low-consumption power conversion.
- Other aspects: such as HVAC, power line monitors, medical equipment, communication base stations and other fields, to meet high current, heat dissipation and mechanical strength requirements.
♦ Technical Parameters
|
Item |
Specification |
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Laers |
1~32 |
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Board thickness |
0.1mm-7.0mm |
|
Material |
FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
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Max panel size |
32"×48"(800mm×1200mm) |
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Min hole size |
0.075mm |
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Min line width |
3mil(0.075mm) |
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Surface finish |
OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
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Copper thickness |
0.5-7.0OZ |
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Soldermask |
Green/Yellow/Black/White/Red/Blue |
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Silkscreen |
Red/Yellow/Black/White |
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Min PAD |
5mil(0.13mm) |
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Inter package |
Vacuum |
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Outer package |
Carton |
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Outline tolerance |
±0.75mm |
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Hole tolerance |
PTH:±0.05 NPTH:±0.025 |
|
Certificate |
UL,ISO 9001,ISO14001,IATF16949 |
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Special request |
Blind hole+Gold finger + BGA |
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Material Suppilers |
Shengyi, KB, Nanya, ITEQ,etc. |
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