2.0mm Inverter Multilayer HDI PCB Board Assembly With Green Solder Mask
HDI PCB Board for Inverter with Green Solder Mask
♦ What is Solder Mask?
Solder Mask (also called solder resist or solder stop mask) is a thin, protective layer of polymer applied to the copper traces of a printed circuit board (PCB) to prevent oxidation, short circuits, and unintended solder connections during assembly.
Key Characteristics:
-
- Prevents Solder Bridging
- Covers exposed copper traces to avoid accidental solder connections between pads or traces.
- Protects Copper from Oxidation
- Shields copper from moisture, dust, and environmental damage.
- Improves Electrical Insulation
- Acts as a dielectric barrier to prevent electrical shorts.
- Enhances PCB Durability
- Resists scratches, chemicals, and mechanical stress.
- Aesthetic & Identification
- Typically green (but available in other colors) with silkscreen markings for component placement.
- Prevents Solder Bridging
♦ Types of Solder Mask?
| Type | Description | Common Uses |
|---|---|---|
| Liquid Photoimageable (LPI) | Applied as a liquid, exposed to UV light, and developed (most common). | Standard PCBs, high-precision designs. |
| Dry Film Solder Mask | Pre-formed film laminated onto the PCB, then UV-exposed and etched. | High-density PCBs (HDI). |
| Top & Bottom Side Masks | Applied only to specific sides (e.g., single-sided PCBs). | Simple boards with limited layers. |
| Peelable Solder Mask | Temporary mask that can be removed after soldering. | Selective protection during assembly. |
♦ Types of Solder Mask?
| Feature | Solder Mask Covered | Exposed Copper (No Mask) | Solder Mask Defined (SMD) Pads | Non-Solder Mask Defined (NSMD) Pads |
|---|---|---|---|---|
| Protection | Yes | No | Partial (mask covers edges) | No (pad extends beyond mask) |
| Solderability | Prevents solder spreading | Solder adheres fully | Controlled solder flow | More solder volume |
| Common Use | General traces | Test points, ground pads | Fine-pitch components (BGAs, QFNs) | High-reliability soldering |
♦ Technical Parameters
|
Item |
Spec |
|
Layers |
1~64 |
|
Board Thickness |
0.1mm-10 mm |
|
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
|
Max Panel Size |
800mm×1200mm |
|
Min Hole Size |
0.075mm |
|
Min Line Width/Space |
Standard: 3mil(0.075mm) Advance: 2mil |
|
Board Outline Tolerance |
士0.10mm |
|
Insulation Layer Thickness |
0.075mm--5.00mm |
|
Out Layer Copper Thickness |
18um--350um |
|
Drilling Hole (Mechanical) |
17um--175um |
|
Finish Hole (Mechanical) |
17um--175um |
|
Diameter Tolerance (Mechanical) |
0.05mm |
|
Registration (Mechanical) |
0.075mm |
|
Aspect Ratio |
17:01 |
|
Solder Mask Type |
LPI |
|
SMT Min. Solder Mask Width |
0.075mm |
|
Min. Solder Mask Clearance |
0.05mm |
|
Plug Hole Diameter |
0.25mm--0.60mm |
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